Chiu Sheng-Ren, Teng Li-Tao, Chao Jen-Wei, Sue Chung-Yang, Lin Chih-Hsiou, Chen Hong-Ren, Su Yan-Kuin
Microsystems Technology Center, Industrial Technology Research Institute, Tainan 709, Taiwan.
Institute of Microelectronics and Department of Electrical Engineering, Advanced Optoelectronic Technology Center, National Cheng Kung University, Tainan 701, Taiwan.
Sensors (Basel). 2014 Mar 4;14(3):4290-311. doi: 10.3390/s140304290.
An active thermal compensation system for a low temperature-bias-drift (TBD) MEMS-based gyroscope is proposed in this study. First, a micro-gyroscope is fabricated by a high-aspect-ratio silicon-on-glass (SOG) process and vacuum packaged by glass frit bonding. Moreover, a drive/readout ASIC, implemented by the 0.25 µm 1P5M standard CMOS process, is designed and integrated with the gyroscope by directly wire bonding. Then, since the temperature effect is one of the critical issues in the high performance gyroscope applications, the temperature-dependent characteristics of the micro-gyroscope are discussed. Furthermore, to compensate the TBD of the micro-gyroscope, a thermal compensation system is proposed and integrated in the aforementioned ASIC to actively tune the parameters in the digital trimming mechanism, which is designed in the readout ASIC. Finally, some experimental results demonstrate that the TBD of the micro-gyroscope can be compensated effectively by the proposed compensation system.
本研究提出了一种用于低温偏置漂移(TBD)的基于微机电系统(MEMS)的陀螺仪的有源热补偿系统。首先,通过高深宽比的玻璃上硅(SOG)工艺制造微陀螺仪,并通过玻璃料键合进行真空封装。此外,采用0.25μm 1P5M标准CMOS工艺实现的驱动/读出专用集成电路(ASIC),通过直接引线键合与陀螺仪进行设计和集成。然后,由于温度效应是高性能陀螺仪应用中的关键问题之一,因此讨论了微陀螺仪的温度相关特性。此外,为了补偿微陀螺仪的TBD,提出了一种热补偿系统,并将其集成到上述ASIC中,以主动调整读出ASIC中设计的数字微调机制中的参数。最后,一些实验结果表明,所提出的补偿系统可以有效地补偿微陀螺仪的TBD。