Moore Cameron M, Quist David A, Kampf Jeff W, Szymczak Nathaniel K
Department of Chemistry, University of Michigan , Ann Arbor, Michigan 48109, United States.
Inorg Chem. 2014 Apr 7;53(7):3278-80. doi: 10.1021/ic5003594. Epub 2014 Mar 21.
A tripodal ligand based on 2-hydroxypyridine is presented. Cu-Cl adducts of H3thpa with Cu(I) and Cu(II) provide complexes featuring highly directed, intramolecular hydrogen-bonding interactions. An upper limit for the hydrogen-bonding free energy to Cu(I)-Cl was estimated at ∼18 kcal/mol.
本文介绍了一种基于2-羟基吡啶的三脚架配体。H3thpa与Cu(I)和Cu(II)的Cu-Cl加合物提供了具有高度定向的分子内氢键相互作用的配合物。估计与Cu(I)-Cl的氢键自由能上限约为18千卡/摩尔。