Zhou Li, Qian Yuetong, Zhu Ye, Liu Hong, Gan Kang, Guo Jing
College and Hospital of Stomatology, Jilin University, 1500 Qing Hua Road, Changchun 130021, PR China.
Clinical Medical College, Jilin University, 828 Xin Min Street, Changchun 130021, PR China.
Dent Mater. 2014 Aug;30(8):e209-15. doi: 10.1016/j.dental.2014.03.011. Epub 2014 Apr 24.
To evaluate the effect of different surface treatments on the bond strength between polyetheretherketone (PEEK) composite materials and each of two different luting cements.
One hundred specimens were randomly divided into five groups (n=20/group) as follows: (A) no treatment, (B) 98% sulfuric acid, (C) 9.5% hydrofluoric acid, (D) argon plasma treatment, and (E) sandblast with 50μm Al2O3 particles. Each group was divided into two subgroups of different cements: RelyX™ Unicem and SE Bond/Clearfil AP-X™. The cements were bonded onto the specimens. All specimens were stored in distilled water at 37° for 24h. Bond strength was measured in a shear test, and failure modes were assessed by stereomicroscopy. The surfaces were observed by SEM after the different pretreatments.
Etching with 98% sulfuric acid and argon plasma treatment can significantly enforce the bond strength of RelyX™ Unicem or SE Bond/Clearfil AP-X™ to PEEK composite materials in comparison to the group of no treatment, hydrofluoric acid or sandblasting (p<0.05). No adhesion was established on the groups of no treatment and hydrofluoric acid when RelyX™ Unicem was used. Applying the SE Bond/Clearfil AP-X™ system, no statistical differences were found whether hydrofluoric acid was applied or not (p>0.05). The shear bond strength value of using SE Bond/Clearfil AP-X™ was higher than that of using RelyX™ Unicem with the same surface conditioning method (p<0.05).
The use of SE Bond/Clearfil AP-X™ after the surface of PEEK composite material treated with sulfuric acid or argon plasma can be recommended as an effective bonding method.
评估不同表面处理对聚醚醚酮（PEEK）复合材料与两种不同粘结水门汀之间粘结强度的影响。
将100个样本随机分为五组（每组n = 20），如下：（A）未处理，（B）98%硫酸，（C）9.5%氢氟酸，（D）氩等离子体处理，以及（E）用50μm Al2O3颗粒喷砂处理。每组再分为使用不同水门汀的两个亚组：RelyX™ Unicem和SE Bond/Clearfil AP-X™。将水门汀粘结到样本上。所有样本在37°蒸馏水中储存24小时。通过剪切试验测量粘结强度，并通过体视显微镜评估失效模式。在不同预处理后通过扫描电子显微镜观察表面。
与未处理、氢氟酸或喷砂处理组相比，用98%硫酸蚀刻和氩等离子体处理可显著增强RelyX™ Unicem或SE Bond/Clearfil AP-X™与PEEK复合材料之间的粘结强度（p<0.05）。使用RelyX™ Unicem时，未处理组和氢氟酸组未形成粘结。应用SE Bond/Clearfil AP-X™系统时，无论是否应用氢氟酸均未发现统计学差异（p>0.05）。在相同表面处理方法下，使用SE Bond/Clearfil AP-X™的剪切粘结强度值高于使用RelyX™ Unicem的（p<0.05）。
在PEEK复合材料表面用硫酸或氩等离子体处理后使用SE Bond/Clearfil AP-X™可作为一种有效的粘结方法推荐使用。
