分子桥实现了硬-软材料界面热输运的异常增强。
Molecular bridge enables anomalous enhancement in thermal transport across hard-soft material interfaces.
机构信息
Department of Aerospace and Mechanical Engineering, University of Notre Dame, Notre Dame, IN, 46556, USA; Institute of Engineering Thermophysics, Chinese Academy of Sciences, Beijing, 100190, China; University of Chinese Academy of Sciences, Beijing, 100049, China.
出版信息
Adv Mater. 2014 Sep 17;26(35):6093-9. doi: 10.1002/adma.201400954. Epub 2014 May 20.
Conventional wisdom tells us that interfacial thermal transport is more efficient when the interface adhesion energy is enhanced. In this study, it is demonstrated that molecular bridges consisting of small molecules chemically absorbed on solid surfaces can enhance the thermal transport across hard-soft material interfaces by as much as 7-fold despite a significant decrease in the interface adhesion energy. This work provides an unconventional strategy to improve thermal transport across material interfaces.
传统观点认为，增强界面黏附能可以提高界面热输运性能。本研究表明，尽管界面黏附能显著降低，但由化学吸附在固体表面上的小分子构成的分子桥仍可将硬-软材料界面的热输运提高 7 倍。该工作提供了一种改善材料界面热输运的非常规策略。
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