Zeng Xiangliang, Liang Ting, Cheng Xiaxia, Fan Jianfeng, Pang Yunsong, Xu Jianbin, Sun Rong, Xia Xinnian, Zeng Xiaoliang
College of Chemistry and Chemical Engineering, Hunan University, Lushan South Road, Yuelu District, Changsha 410082, People's Republic of China.
State Key Laboratory of Materials for Integrated Circuits, Shenzhen Institute of Advanced Electronic Materials, Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences, Shenzhen 518055, People's Republic of China.
Nano Lett. 2024 May 29;24(21):6386-6394. doi: 10.1021/acs.nanolett.4c01409. Epub 2024 May 14.
Adhesion ability and interfacial thermal transfer capacity at soft/hard interfaces are of critical importance to a wide variety of applications, ranging from electronic packaging and soft electronics to batteries. However, these two properties are difficult to obtain simultaneously due to their conflicting nature at soft/hard interfaces. Herein, we report a polyurethane/silicon interface with both high adhesion energy (13535 J m) and low thermal interfacial resistance (0.89 × 10 m K W) by regulating hydrogen interactions at the interface. This is achieved by introducing a soybean-oil-based epoxy cross-linker, which can destroy the hydrogen bonds in polyurethane networks and meanwhile can promote the formation of hydrogen bonds at the polyurethane/silicon interface. This study provides a comprehensive understanding of enhancing adhesion energy and reducing interfacial thermal resistance at soft/hard interfaces, which offers a promising perspective to tailor interfacial properties in various material systems.
软/硬界面处的粘附能力和界面热传递能力对于从电子封装、柔性电子到电池等广泛的应用至关重要。然而，由于这两种特性在软/硬界面处相互冲突，因此难以同时获得。在此，我们通过调节界面处的氢键相互作用，报道了一种具有高粘附能（13535 J m）和低热界面电阻（0.89×10 m K W）的聚氨酯/硅界面。这是通过引入一种大豆油基环氧交联剂来实现的，该交联剂可以破坏聚氨酯网络中的氢键，同时促进聚氨酯/硅界面处氢键的形成。本研究全面理解了增强软/硬界面处的粘附能和降低界面热阻的方法，为在各种材料系统中定制界面特性提供了一个有前景的视角。
