Ji Xu, Jiang Lan, Li Xiaowei, Han Weina, Liu Yang, Huang Qiang, Lu Yongfeng
Appl Opt. 2014 Oct 10;53(29):6742-8. doi: 10.1364/AO.53.006742.
Formation of the elliptical-shaped craters on a silicon surface is investigated comprehensively using a single shot of a femtosecond laser. It is observed that the ablation craters are elongated along the major axis of the polarization direction, while their orientation is parallel to the polarization direction. The ablation area grows and the morphology of the craters evolves from an ellipse to nearly a circle with increasing fluence. The underlying physical mechanism is revealed through numerical simulations that are based on the finite-difference time-domain technique. It is suggested that the initially formed craters or surface defects lead to the redistribution of the electric field on the silicon surface, which plays a crucial role in the creation of the elliptical-shaped craters. In addition, the field intensity becomes enhanced along the incident laser polarization direction, which determines the elliptical crater orientations.
利用飞秒激光单次脉冲对硅表面椭圆形凹坑的形成进行了全面研究。观察到烧蚀凹坑沿偏振方向的长轴拉长,而其取向与偏振方向平行。随着能量密度的增加,烧蚀面积增大,凹坑形态从椭圆形演变为近似圆形。通过基于时域有限差分技术的数值模拟揭示了其潜在的物理机制。研究表明,最初形成的凹坑或表面缺陷导致硅表面电场重新分布,这在椭圆形凹坑的形成中起关键作用。此外,电场强度沿入射激光偏振方向增强,这决定了椭圆形凹坑的取向。