用于响应式神经接口的形状记忆聚合物基板实现的三维柔性电子器件。
Three-Dimensional Flexible Electronics Enabled by Shape Memory Polymer Substrates for Responsive Neural Interfaces.
作者信息
Ware Taylor, Simon Dustin, Hearon Keith, Liu Clive, Shah Sagar, Reeder Jonathan, Khodaparast Navid, Kilgard Michael P, Maitland Duncan J, Rennaker Robert L, Voit Walter E
机构信息
Assistant Professor, Department of Materials Science and Engineering, The University of Texas at Dallas, Mailstop RL10, 800 West Campbell Rd., Richardson, TX 75080, USA.
Department of Biomedical Engineering, Texas A&M University, College Station, TX 77843, USA.
出版信息
Macromol Mater Eng. 2012 Dec 1;297(12):1193-1202. doi: 10.1002/mame.201200241.
Abstract
Planar electronics processing methods have enabled neural interfaces to become more precise and deliver more information. However, this processing paradigm is inherently 2D and rigid. The resulting mechanical and geometrical mismatch at the biotic-abiotic interface can elicit an immune response that prevents effective stimulation. In this work, a thiol-ene/acrylate shape memory polymer is utilized to create 3D softening substrates for stimulation electrodes. This substrate system is shown to soften from more than 600 to 6 MPa. A nerve cuff electrode that coils around the vagus nerve in a rat and that drives neural activity is demonstrated.
摘要
平面电子加工方法已使神经接口变得更加精确并能传递更多信息。然而，这种加工模式本质上是二维且刚性的。在生物-非生物界面产生的机械和几何不匹配会引发免疫反应，从而阻止有效刺激。在这项工作中，一种硫醇-烯/丙烯酸酯形状记忆聚合物被用于制造用于刺激电极的三维软化基板。该基板系统显示出能从600多兆帕软化至6兆帕。展示了一种缠绕在大鼠迷走神经上并驱动神经活动的神经袖套电极。
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