Suppr超能文献

自动会聚束电子衍射(CBED)处理:基于晶带轴CBED图案分析的样品厚度估计

Automated CBED processing: sample thickness estimation based on analysis of zone-axis CBED pattern.

作者信息

Klinger M, Němec M, Polívka L, Gärtnerová V, Jäger A

机构信息

Laboratory of nanostructures and nanomaterials, Institute of Physics of the ASCR, Na Slovance 2, 182 21 Prague 8, Czech Republic.

Laboratory of nanostructures and nanomaterials, Institute of Physics of the ASCR, Na Slovance 2, 182 21 Prague 8, Czech Republic.

出版信息

Ultramicroscopy. 2015 Mar;150:88-95. doi: 10.1016/j.ultramic.2014.12.006. Epub 2014 Dec 16.

Abstract

An automated processing of convergent beam electron diffraction (CBED) patterns is presented. The proposed methods are used in an automated tool for estimating the thickness of transmission electron microscopy (TEM) samples by matching an experimental zone-axis CBED pattern with a series of patterns simulated for known thicknesses. The proposed tool detects CBED disks, localizes a pattern in detected disks and unifies the coordinate system of the experimental pattern with the simulated one. The experimental pattern is then compared disk-by-disk with a series of simulated patterns each corresponding to different known thicknesses. The thickness of the most similar simulated pattern is then taken as the thickness estimate. The tool was tested on [0 1 1] Si, [0 1 0] α-Ti and [0 1 1] α-Ti samples prepared using different techniques. Results of the presented approach were compared with thickness estimates based on analysis of CBED patterns in two beam conditions. The mean difference between these two methods was 4.1% for the FIB-prepared silicon samples, 5.2% for the electro-chemically polished titanium and 7.9% for Ar(+) ion-polished titanium. The proposed techniques can also be employed in other established CBED analyses. Apart from the thickness estimation, it can potentially be used to quantify lattice deformation, structure factors, symmetry, defects or extinction distance.

摘要

本文介绍了会聚束电子衍射(CBED)图案的自动化处理方法。所提出的方法应用于一种自动化工具中,该工具通过将实验区域轴CBED图案与一系列针对已知厚度模拟的图案进行匹配,来估计透射电子显微镜(TEM)样品的厚度。所提出的工具可检测CBED圆盘,在检测到的圆盘中定位图案,并将实验图案的坐标系与模拟图案的坐标系统一。然后将实验图案与一系列模拟图案逐盘进行比较,每个模拟图案对应不同的已知厚度。然后将最相似模拟图案的厚度作为厚度估计值。该工具在使用不同技术制备的[0 1 1]硅、[0 1 0]α-钛和[0 1 1]α-钛样品上进行了测试。将所提出方法的结果与基于双束条件下CBED图案分析的厚度估计值进行了比较。对于聚焦离子束(FIB)制备的硅样品,这两种方法的平均差异为4.1%;对于电化学抛光的钛样品,平均差异为5.2%;对于氩离子(Ar(+))抛光的钛样品,平均差异为7.9%。所提出的技术也可用于其他已有的CBED分析。除了厚度估计外,它还可能用于量化晶格变形、结构因子、对称性、缺陷或消光距离。

文献AI研究员

20分钟写一篇综述,助力文献阅读效率提升50倍。

立即体验

用中文搜PubMed

大模型驱动的PubMed中文搜索引擎

马上搜索

文档翻译

学术文献翻译模型,支持多种主流文档格式。

立即体验