Park No-Won, Lee Won-Yong, Hong Ji-Eun, Park Tae-Hyun, Yoon Soon-Gil, Im Hyunsik, Kim Hyung Sang, Lee Sang-Kwon
Department of Physics, Chung-Ang University, Seoul, 156-756 Republic of Korea.
Department of Materials Engineering, Chungnam National University, Daejeon, 305-764 Republic of Korea.
Nanoscale Res Lett. 2015 Jan 28;10:20. doi: 10.1186/s11671-015-0733-6. eCollection 2015.
The effects of grain size and strain on the temperature-dependent thermal transport of antimony telluride (Sb2Te3) thin films, controlled using post-annealing temperatures of 200°C to 350°C, were investigated using the 3-omega method. The measured total thermal conductivities of 400-nm-thick thin films annealed at temperatures of 200°C, 250°C, 300°C, 320°C, and 350°C were determined to be 2.0 to 3.7 W/m · K in the 20 to 300 K temperature range. We found that the film grain size, rather than the strain, had the most prominent effect on the reduction of the total thermal conductivity. To confirm the effect of grain size on temperature-dependent thermal transport in the thin films, the experimental results were analyzed using a modified Callaway model approach.
利用3-ω法研究了通过200℃至350℃的后退火温度控制的碲化锑(Sb2Te3)薄膜的晶粒尺寸和应变对其与温度相关的热输运的影响。在20至300K的温度范围内,对在200℃、250℃、300℃、320℃和350℃温度下退火的400nm厚薄膜测得的总热导率为2.0至3.7W/m·K。我们发现,对总热导率降低影响最显著的是薄膜晶粒尺寸,而非应变。为了证实晶粒尺寸对薄膜中与温度相关的热输运的影响,采用改进的卡拉韦模型方法对实验结果进行了分析。