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神经工程中的软物质材料解决神经科学中的硬问题。

Soft materials in neuroengineering for hard problems in neuroscience.

机构信息

Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA.

Department of Electrical and Computer Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA.

出版信息

Neuron. 2015 Apr 8;86(1):175-86. doi: 10.1016/j.neuron.2014.12.035.

Abstract

We describe recent advances in soft electronic interface technologies for neuroscience research. Here, low modulus materials and/or compliant mechanical structures enable modes of soft, conformal integration and minimally invasive operation that would be difficult or impossible to achieve using conventional approaches. We begin by summarizing progress in electrodes and associated electronics for signal amplification and multiplexed readout. Examples in large-area, surface conformal electrode arrays and flexible, multifunctional depth-penetrating probes illustrate the power of these concepts. A concluding section highlights areas of opportunity in the further development and application of these technologies.

摘要

我们描述了神经科学研究中软电子界面技术的最新进展。在这里,低模量材料和/或顺应性机械结构实现了软、贴合集成和微创操作模式,这在使用传统方法时很难或不可能实现。我们首先总结了用于信号放大和多路复用读取的电极和相关电子设备的进展。大面积、表面贴合电极阵列和柔性多功能深穿透探头的例子说明了这些概念的强大之处。最后一节强调了这些技术进一步发展和应用的机会领域。

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