Khan Mansoor Ali, Heo Jun-Woo, Kim Hyun-Seok, Park Hyun-Chang
J Nanosci Nanotechnol. 2014 Nov;14(11):8141-7. doi: 10.1166/jnn.2014.9897.
In this work, different gate-head structures have been compared in the context of AlGaN/GaN-based high-electron-mobility transistors (HEMTs). Field-plate (FP) technology self-aligned to the gate electrode leads to various gate-head structures, most likely gamma (γF)-gate, camel (see symbol)-gate, and mushroom-shaped (T)-gate. In-depth comparison of recessed gate-head structures demonstrated that key performance metrics such as transconductance, output current, and breakdown voltage are better with the T-gate head structure. The recessed T-gate with its one arm toward the source side not only reduces the source-access resistance (R(g) +R(gs)), but also minimizes the source-side dispersion and current leakage, resulting in high transconductance (G(m)) and output current (I(DS)). At the same time, the other arm toward the drain-side reduces the drain-side dispersion and tends to distribute electric field peaks uniformly, resulting in high breakdown voltage (V(BR)). DC and RF analysis showed that the recessed T-gate FP-HEMT is a suitable candidate not only for high-frequency operation, but also for high-power applications.
在这项工作中,在基于AlGaN/GaN的高电子迁移率晶体管(HEMT)的背景下对不同的栅头结构进行了比较。与栅电极自对准的场板(FP)技术导致了各种栅头结构,最有可能的是γ(γF)栅、骆驼(见符号)栅和蘑菇形(T)栅。对凹陷栅头结构的深入比较表明,诸如跨导、输出电流和击穿电压等关键性能指标在T栅头结构下表现更好。朝向源极侧有一个臂的凹陷T栅不仅降低了源极接入电阻(R(g)+R(gs)),还使源极侧的分散和电流泄漏最小化,从而产生高跨导(G(m))和输出电流(I(DS))。同时,朝向漏极侧的另一个臂减少了漏极侧的分散,并倾向于使电场峰值均匀分布,从而产生高击穿电压(V(BR))。直流和射频分析表明,凹陷T栅FP-HEMT不仅是高频操作的合适候选者,也是高功率应用的合适候选者。