Jyothi I, Janardhanam V, Kang Min-Sung, Yun Hyung-Joong, Lee Jouhahn, Choi Chel-Jong
J Nanosci Nanotechnol. 2014 Nov;14(11):8176-81. doi: 10.1166/jnn.2014.9893.
The current-voltage characteristics and the carrier-transport mechanism of the Er-silicide (ErSi1.7) Schottky contacts to strained-silicon-on-insulator (sSOI) and silicon-on-insulator (SOI) were investigated. Barrier heights of 0.74 eV and 0.82 eV were obtained for the sSOI and SOI structures, respectively. The barrier height of the sSOI structure was observed to be lower than that of the SoI structure despite the formation of a Schottky contact using the same metal silicide. The sSOI structure exhibited better rectification and higher current level than the SOI structure, which could be associated with a reduction in the band gap of Si caused by strain. The generation-recombination mechanism was found to be dominant in the forward bias for both structures. Carrier generation along with the Poole-Frenkel mechanism dominated the reverse-biased current in the SOI structure. The saturation tendency of the reverse leakage current in the sSOI structure could be attributed to strain-induced defects at the interface in non-lattice-matched structures.
研究了铒硅化物(ErSi1.7)肖特基接触到绝缘体上应变硅(sSOI)和绝缘体上硅(SOI)的电流-电压特性及载流子输运机制。对于sSOI和SOI结构,分别获得了0.74 eV和0.82 eV的势垒高度。尽管使用相同的金属硅化物形成肖特基接触,但观察到sSOI结构的势垒高度低于SOI结构。sSOI结构比SOI结构表现出更好的整流性能和更高的电流水平,这可能与应变导致的硅带隙减小有关。发现两种结构在正向偏置时产生-复合机制占主导。在SOI结构中,载流子产生以及普尔-弗伦克尔机制主导反向偏置电流。sSOI结构中反向漏电流的饱和趋势可归因于非晶格匹配结构界面处的应变诱导缺陷。