Bauer Sebastian, Bobisch Christian A
Faculty of Physics and Center for Nanointegration Duisburg-Essen (CENIDE), University of Duisburg-Essen, Lotharstrasse 1, 47057 Duisburg, Germany.
Nat Commun. 2016 Apr 21;7:11381. doi: 10.1038/ncomms11381.
The use of three-dimensional topological insulators for disruptive technologies critically depends on the dissipationless transport of electrons at the surface, because of the suppression of backscattering at defects. However, in real devices, defects are unavoidable and scattering at angles other than 180° is allowed for such materials. Until now, this has been studied indirectly by bulk measurements and by the analysis of the local density of states in close vicinity to defect sites. Here, we directly measure the nanoscale voltage drop caused by the scattering at step edges, which occurs if a lateral current flows along a three-dimensional topological insulator. The experiments were performed using scanning tunnelling potentiometry for thin Bi2Se3 films. So far, the observed voltage drops are small because of large contributions of the bulk to the electronic transport. However, for the use of ideal topological insulating thin films in devices, these contributions would play a significant role.
将三维拓扑绝缘体用于颠覆性技术,关键取决于表面电子的无耗散输运,这是由于缺陷处的背散射受到抑制。然而,在实际器件中,缺陷不可避免,并且对于此类材料,允许非180°角度的散射。到目前为止,这一直是通过体测量以及对缺陷位点附近局部态密度的分析来间接研究的。在此,我们直接测量了沿三维拓扑绝缘体横向流动的电流在台阶边缘处散射所引起的纳米级电压降。实验是使用扫描隧道电位法对Bi2Se3薄膜进行的。到目前为止,由于体对电子输运的贡献较大,观察到的电压降较小。然而,对于在器件中使用理想的拓扑绝缘薄膜而言,这些贡献将发挥重要作用。