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采用像差校正扫描透射电子显微镜表征立方半导体中的结构缺陷。

Structural defects in cubic semiconductors characterized by aberration-corrected scanning transmission electron microscopy.

作者信息

Arroyo Rojas Dasilva Yadira, Kozak Roksolana, Erni Rolf, Rossell Marta D

机构信息

Electron Microscopy Center, Empa, Swiss Federal Laboratories for Materials Science and Technology, CH-8600 Dübendorf, Switzerland.

Electron Microscopy Center, Empa, Swiss Federal Laboratories for Materials Science and Technology, CH-8600 Dübendorf, Switzerland.

出版信息

Ultramicroscopy. 2017 May;176:11-22. doi: 10.1016/j.ultramic.2016.09.015. Epub 2016 Sep 28.

Abstract

The development of new electro-optical devices and the realization of novel types of transistors require a profound understanding of the structural characteristics of new semiconductor heterostructures. This article provides a concise review about structural defects which occur in semiconductor heterostructures on the basis of micro-patterned Si substrates. In particular, one- and two-dimensional crystal defects are being discussed which are due to the plastic relaxation of epitaxial strain caused by the misfit of crystal lattices. Besides a few selected examples from literature, we treat in particular crystal defects occurring in GaAs/Si, Ge/Si and β-SiC/Si structures which are studied by high-resolution annular dark-field scanning transmission electron microscopy. The relevance of this article is twofold; firstly, it should provide a collection of data which are of help for the identification and characterization of defects in cubic semiconductors by means of atomic-resolution imaging, and secondly, the experimental data shall provide a basis for advancing the understanding of device characteristics with the aid of theoretical modelling by considering the defective nature of strained semiconductor heterostructures.

摘要

新型电光器件的开发以及新型晶体管的实现需要对新型半导体异质结构的结构特性有深入的了解。本文基于微图案化硅衬底,对半导体异质结构中出现的结构缺陷进行了简要综述。特别讨论了由于晶格失配引起的外延应变的塑性弛豫导致的一维和二维晶体缺陷。除了文献中一些选定的例子外,我们还特别研究了通过高分辨率环形暗场扫描透射电子显微镜研究的GaAs/Si、Ge/Si和β-SiC/Si结构中出现的晶体缺陷。本文的意义有两个方面;首先,它应提供一系列有助于通过原子分辨率成像识别和表征立方半导体中缺陷的数据,其次,实验数据应为借助理论建模,通过考虑应变半导体异质结构的缺陷性质来推进对器件特性的理解提供基础。

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