高密度氮化硼三维结构和三维石墨烯用于高性能纳米热界面材料。
High-Density 3D-Boron Nitride and 3D-Graphene for High-Performance Nano-Thermal Interface Material.
机构信息
CNRS-International NTU Thales Research Alliance (CINTRA) UMI 3288 , Research Techno Plaza, 50 Nanyang Drive, Singapore 637553, Singapore.
Institute of Microelectronics, Agency for Science, Technology and Research (A*Star) , 11 Science Park Road, Singapore 117685, Singapore.
出版信息
ACS Nano. 2017 Feb 28;11(2):2033-2044. doi: 10.1021/acsnano.6b08218. Epub 2017 Feb 15.
Compression studies on three-dimensional foam-like graphene and h-BN (3D-C and 3D-BN) revealed their high cross-plane thermal conductivity (62-86 W m K) and excellent surface conformity, characteristics essential for thermal management needs. Comparative studies to state-of-the-art materials and other materials currently under research for heat dissipation revealed 3D-foam's improved performance (20-30% improved cooling, temperature decrease by ΔT of 44-24 °C).
压缩研究表明，三维泡沫状石墨烯和 h-BN（3D-C 和 3D-BN）具有高热面导热系数（62-86 W m K）和优异的表面贴合性，这些特性对于热管理需求至关重要。与现有技术材料和其他正在研究的散热材料的比较研究表明，3D 泡沫材料具有更好的性能（冷却效果提高 20-30%，温度降低 ΔT 为 44-24°C）。
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