School of Electrical and Electronic Engineering, Yonsei University, 50 Yonsei-ro, Seodaemun-gu, Seoul 120-749, Republic of Korea.
Sci Rep. 2017 Feb 23;7:43216. doi: 10.1038/srep43216.
We report a method for fabricating solution-processed quaternary In-Ga-Zn-O (IGZO) thin-film transistors (TFTs) at low annealing temperatures using a vertical diffusion technique (VDT). The VDT is a deposition process for spin-coating binary and ternary oxide layers consecutively and annealing at once. With the VDT, uniform and dense quaternary oxide layers were fabricated at lower temperatures (280 °C). Compared to conventional IGZO and ternary In-Zn-O (IZO) thin films, VDT IGZO thin film had higher density of the metal-oxide bonds and lower density of the oxygen vacancies. The field-effect mobility of VDT IGZO TFT increased three times with an improved stability under positive bias stress than IZO TFT due to the reduction in oxygen vacancies. Therefore, the VDT process is a simple method that reduces the processing temperature without any additional treatment for quaternary oxide semiconductors with uniform layers.
我们报告了一种使用垂直扩散技术(VDT)在低温下制造溶液处理的四元 In-Ga-Zn-O(IGZO)薄膜晶体管(TFT)的方法。VDT 是一种连续旋涂二元和三元氧化物层并同时退火的沉积工艺。使用 VDT,可以在较低温度(280°C)下制造均匀且致密的四元氧化物层。与传统的 IGZO 和三元 In-Zn-O(IZO)薄膜相比,VDT IGZO 薄膜具有更高的金属氧化物键密度和更低的氧空位密度。由于氧空位的减少,VDT IGZO TFT 的场效应迁移率增加了三倍,并且在正偏压应力下的稳定性也得到了改善。因此,VDT 工艺是一种简单的方法,可在不进行任何额外处理的情况下降低处理温度,从而获得具有均匀层的四元氧化物半导体。