Liu Liang, Walcarius Alain
Laboratoire de Chimie Physique et Microbiologie pour l'Environnement, UMR 7564, CNRS-Université de Lorraine, 405 rue de Vandoeuvre, 54600 Villers-lès-Nancy, France.
Phys Chem Chem Phys. 2017 Jun 14;19(23):14972-14983. doi: 10.1039/c7cp01775h.
Electrochemically-assisted deposition is now becoming a widespread method for preparing sol-gel films. It is based on the electrochemical generation of OH ions, which can then catalyze the sol-gel condensation reactions. It has a key advantage of selectively facilitating the film deposition on electrochemically active surfaces while not affecting the stability of the bulk precursor solution. Experimental studies have clearly shown that the thickness of the electrochemically-assisted deposited films is influenced by the deposition parameters such as the potential and time. However, there is still a lack of quantitative description of the kinetics of film growth due to the complexity of the process. In this preliminary study, we derived quantitative analytical expressions for describing the kinetics associated with the growth of sol-gel films generated by electrochemically assisted deposition. Both heterogeneous and homogeneous condensation reactions were considered. The key strategy was to simplify the process by separating the electrochemical step of generating OH ions with the condensation steps of film formation under approximation. Furthermore, numerical simulation was carried out to examine the validity and any errors in the analytical expressions in the cases when the required approximations were not fulfilled. The analytical expressions could well explain the trends observed in the experimental studies and could also be used for fitting the experimental results from the literature. This study provides a deeper understanding of the mechanism and quantitative guidance for manipulating electrochemically-assisted deposition processes at a large scale in industry. It may also be referred to in regard to other indirect electrodeposition systems in which the deposition is not an electrochemical step but is instead driven by electrochemically-generated catalysts.
电化学辅助沉积目前正成为制备溶胶-凝胶薄膜的一种广泛应用的方法。它基于OH离子的电化学产生,然后OH离子可催化溶胶-凝胶缩合反应。其关键优势在于能够选择性地促进薄膜在电化学活性表面上的沉积,同时不影响本体前驱体溶液的稳定性。实验研究清楚地表明,电化学辅助沉积薄膜的厚度受诸如电势和时间等沉积参数的影响。然而,由于该过程的复杂性,仍然缺乏对薄膜生长动力学的定量描述。在这项初步研究中,我们推导了用于描述与电化学辅助沉积产生的溶胶-凝胶薄膜生长相关的动力学的定量分析表达式。同时考虑了非均相和均相缩合反应。关键策略是通过在近似条件下将产生OH离子的电化学步骤与薄膜形成的缩合步骤分开来简化该过程。此外,进行了数值模拟,以检验在未满足所需近似条件的情况下分析表达式的有效性和任何误差。这些分析表达式能够很好地解释实验研究中观察到的趋势,也可用于拟合文献中的实验结果。本研究为大规模工业中操纵电化学辅助沉积过程的机制提供了更深入的理解和定量指导。对于其他间接电沉积系统,其中沉积不是电化学步骤而是由电化学产生的催化剂驱动,本研究也可能具有参考价值。