Li Yong-Mei, Zhuge Rui-Shen, Zhang Zu-Tai, Tian Yue-Ming, Ding Ning
School of Stomatology, Capital Medical University, Beijing, China.
PLoS One. 2017 Jun 22;12(6):e0179668. doi: 10.1371/journal.pone.0179668. eCollection 2017.
This study was conducted to investigate the effect of subpressure on the bond strength of resin to zirconia ceramic. The subpressure would create a pressure gradient which could clean out the bubbles in the adhesives or bonding interface.
Twenty-eight pre-sintered zirconia discs were fabricated. Half of them were polished (group P, n = 14), and the rest were sandblasted (group S, n = 14). After sintered,the surface roughness of the zirconia discs was measured. Then, they were randomly divided into two subgroups (n = 7). The groups were named as follows: PC: P + no additional treatments; PP: P + 0.04 MPa after application of adhesives; SC: S + no additional treatments; and SP: S + 0.04 MPa after application of adhesives. Resin columns were bonded to the zirconia specimens to determine shear bond strength (SBS). The bonding interfaces were observed and the fracture modes were evaluated. Statistical analysis was performed on all data.
The surface roughness of group S was significantly higher than that of group P (P<0.05). The SBS values were PC = 13.48 ± 0.7 MPa, PP = 15.22 ± 0.8 MPa, SC = 17.23 ± 0.7 MPa and SP = 21.68 ± 1.4 MPa. There were significant differences among the groups (P<0.05). Scanning electron microscopy (SEM) results showed that the adhesives of group SP and PP were closer and denser to the zirconia ceramic than that of group PC and SC. The proportion of the mixed fracture mode significantly increased after adding subpressure (P< 0.05).
Subpressure can improve the shear bond strength of resin to zirconia ceramics and increase micro-infiltration between the adhesives and the zirconia ceramics, especially on the rough surfaces.
本研究旨在探讨负压对树脂与氧化锆陶瓷粘结强度的影响。负压会产生压力梯度，可清除粘合剂或粘结界面中的气泡。
制作28个预烧结氧化锆圆盘。其中一半进行抛光（P组，n = 14），其余进行喷砂处理（S组，n = 14）。烧结后，测量氧化锆圆盘的表面粗糙度。然后，将它们随机分为两个亚组（n = 7）。分组如下：PC：P + 无额外处理；PP：P + 施加粘合剂后施加0.04 MPa负压；SC：S + 无额外处理；SP：S + 施加粘合剂后施加0.04 MPa负压。将树脂柱粘结到氧化锆试件上以测定剪切粘结强度（SBS）。观察粘结界面并评估断裂模式。对所有数据进行统计分析。
S组的表面粗糙度显著高于P组（P<0.05）。SBS值分别为PC = 13.48 ± 0.7 MPa、PP = 15.22 ± 0.8 MPa、SC = 17.23 ± 0.7 MPa和SP = 21.68 ± 1.4 MPa。各组之间存在显著差异（P<0.05）。扫描电子显微镜（SEM）结果显示，与PC组和SC组相比，SP组和PP组的粘合剂与氧化锆陶瓷结合更紧密、更致密。施加负压后，混合断裂模式的比例显著增加（P<0.05）。
负压可提高树脂与氧化锆陶瓷之间的剪切粘结强度，并增加粘合剂与氧化锆陶瓷之间的微浸润，尤其是在粗糙表面上。
