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量化非接触式探针-样品热交换参数以实现使用加热微探针的精确扫描热显微镜检查。

Quantifying non-contact tip-sample thermal exchange parameters for accurate scanning thermal microscopy with heated microprobes.

作者信息

Wilson Adam A, Borca-Tasciuc Theodorian

机构信息

Department of Mechanical, Aerospace and Nuclear Engineering, Rensselaer Polytechnic Institute, 110 8th St., Troy, New York 12180, USA.

出版信息

Rev Sci Instrum. 2017 Jul;88(7):074903. doi: 10.1063/1.4991017.

Abstract

Simplified heat-transfer models are widely employed by heated probe scanning thermal microscopy techniques for determining thermal conductivity of test samples. These parameters have generally been assumed to be independent of sample properties; however, there has been little investigation of this assumption in non-contact mode, and the impact calibration procedures have on sample thermal conductivity results has not been explored. However, there has been little investigation of the commonly used assumption that thermal exchange parameters are sample independent in non-contact mode, or of the impact calibration procedures have on sample thermal conductivity results. This article establishes conditions under which quantitative, localized, non-contact measurements using scanning thermal microscopy with heated microprobes may be most accurately performed. The work employs a three-dimensional finite element (3DFE) model validated using experimental results and no fitting parameters, to determine the dependence of a heated microprobe thermal resistance as a function of sample thermal conductivity at several values of probe-to-sample clearance. The two unknown thermal exchange parameters were determined by fitting the 3DFE simulated probe thermal resistance with the predictions of a simplified probe heat transfer model, for two samples with different thermal conductivities. This calibration procedure known in experiments as the intersection method was simulated for sample thermal conductivities in the range of 0.1-50 W m K and clearance values in the 260-1010 nm range. For a typical Wollaston wire microprobe geometry as simulated here, both the thermal exchange radius and thermal contact resistance were found to increase with the sample thermal conductivity in the low thermal conductivity range while they remained approximately constant for thermal conductivities >1 W m K, with similar trends reported for all clearance values investigated. It is shown that versatile sets of calibration samples for the intersection method should employ either medium range (1 W m K) and (2 W m K) thermal conductivities, or wide range (0.5 W m K) and (50 W m K). The medium range yielded results within 1.5%-20.4% of the expected values of thermal conductivity for specimens with thermal conductivity within 0.1-10 W m K, while the wide range yielded values within 0.5%-19.4% in the same range.

摘要

简化的传热模型被加热探针扫描热显微镜技术广泛用于测定测试样品的热导率。这些参数通常被认为与样品特性无关;然而,在非接触模式下对这一假设的研究很少,并且校准程序对样品热导率结果的影响也未被探讨。然而,对于非接触模式下热交换参数与样品无关这一常用假设,或者校准程序对样品热导率结果的影响,几乎没有研究。本文确定了使用加热微探针的扫描热显微镜进行定量、局部、非接触测量时能够最准确执行的条件。这项工作采用了一个三维有限元(3DFE)模型,该模型通过实验结果验证且无拟合参数,以确定在几个探针与样品间隙值下,加热微探针热阻随样品热导率的变化关系。对于两种具有不同热导率的样品,通过将3DFE模拟的探针热阻与简化探针传热模型的预测结果进行拟合,确定了两个未知的热交换参数。在实验中被称为交点法的这种校准程序,针对0.1 - 50 W m K范围内的样品热导率和260 - 1010 nm范围内的间隙值进行了模拟。对于此处模拟的典型沃拉斯顿线微探针几何形状,发现热交换半径和热接触电阻在低热导率范围内均随样品热导率增加,而对于热导率>1 W m K时它们大致保持恒定,在所研究的所有间隙值下均呈现类似趋势。结果表明,用于交点法的通用校准样品集应采用中等范围(1 W m K)和(2 W m K)的热导率,或者宽范围(0.5 W m K)和(50 W m K)的热导率。中等范围对于热导率在0.1 - 10 W m K范围内的样品,得到的结果在热导率预期值的1.5% - 20.4%以内,而宽范围在相同范围内得到的值在0.5% - 19.4%以内。

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