Utah Center for Advanced Imaging Research, University of Utah, Salt Lake City, UT, USA.
Med Phys. 2017 Nov;44(11):5930-5937. doi: 10.1002/mp.12513. Epub 2017 Aug 31.
To study the accuracy and precision of T estimates using the Variable Flip Angle (VFA) method in 2D and 3D acquisitions.
Excitation profiles were simulated using numerical implementation of the Bloch equations for Hamming-windowed sinc excitation pulses with different time-bandwidth products (TBP) of 2, 6, and 10 and for T values of 295 ms and 1045 ms. Experimental data were collected in 5° increments from 5° to 90° for the same T and TBP values. T was calculated for every combination of flip angle with and without a correction for B and slice profile variation. Calculations were also made for flat slice profile such as obtained in 3D acquisition. Monte Carlo simulations were performed to obtain T measurement uncertainty.
VFA T measurements in 2D without correction can result in a 40-80% underestimation of true T . Flip angle correction can reduce the underestimation, but results in accurate measurements of T only within a narrow band of flip angle combinations. The narrow band of accuracy increases with TBP, but remains too narrow for any practical range of T values or B variation. Simulated noisy VFA T measurements in 3D were accurate as long as the two angles chosen are on either side of the Ernst angle.
Accurate T1 estimates from VFA 2D acquisitions are possible, but only a narrow range of T1 values within a narrow range of flip angle combinations can be accurately calculated using a 2D slice. Unless a better flip angle correction method is used, these results demonstrate that accurate measurements of T1 in 2D cannot be obtained robustly enough for practical use and are more likely obtained by a thin slab 3D VFA acquisition than from multiple-slice 2D acquisitions. VFA T measurements in 3D are accurate for wide ranges of flip angle combinations and T values.
研究二维和三维采集中使用可变翻转角(VFA)方法的 T 估计的准确性和精密度。
使用数值实现的 Bloch 方程模拟汉明窗 sinc 激发脉冲的激发谱,具有不同的时带宽积(TBP)为 2、6 和 10,以及 T 值为 295ms 和 1045ms。对于相同的 T 和 TBP 值,以 5°的增量从 5°收集到 90°的实验数据。对于每个翻转角组合,无论是否进行 B 和切片轮廓变化的校正,都计算了 T。还计算了类似于 3D 采集中获得的平坦切片轮廓的 T。进行了蒙特卡罗模拟以获得 T 测量不确定性。
二维 VFA T 测量未经校正可能导致真实 T 值的 40-80%低估。翻转角校正可以减少低估,但仅在翻转角组合的窄带内准确测量 T。准确性的窄带随着 TBP 的增加而增加,但对于任何实际的 T 值或 B 变化范围仍然太窄。只要选择的两个角度在 Ernst 角的任一侧,模拟的 3D 嘈杂 VFA T 测量都是准确的。
二维 VFA 采集可以准确估计 T1,但只能在非常窄的翻转角组合范围内准确计算非常窄的 T1 值。除非使用更好的翻转角校正方法,否则这些结果表明,二维中 T1 的准确测量不足以满足实际使用的要求,并且更有可能通过薄切片 3D VFA 采集而不是通过多层 2D 采集获得。3D 中的 VFA T 测量对于广泛的翻转角组合和 T 值是准确的。