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基于共价偶联银纳米粒子的共轭聚合物的电增强抗菌涂层可防止金黄色葡萄球菌生物膜的形成。

Electroenhanced Antimicrobial Coating Based on Conjugated Polymers with Covalently Coupled Silver Nanoparticles Prevents Staphylococcus aureus Biofilm Formation.

机构信息

Swedish Medical Nanoscience Center, Department of Neuroscience, Karolinska Institutet, 171 77, Stockholm, Sweden.

Department of Neuroscience, Karolinska Institutet, 171 77, Stockholm, Sweden.

出版信息

Adv Healthc Mater. 2017 Oct;6(20). doi: 10.1002/adhm.201700435. Epub 2017 Aug 14.

Abstract

The incidence of hospital-acquired infections is to a large extent due to device-associated infections. Bacterial attachment and biofilm formation on surfaces of medical devices often act as seeding points of infection. To prevent such infections, coatings based on silver nanoparticles (AgNPs) are often applied, however with varying clinical success. Here, the traditional AgNP-based antibacterial technology is reimagined, now forming the base for an electroenhanced antimicrobial coating. To integrate AgNPs in an electrically conducting polymer layer, a simple, yet effective chemical strategy based on poly(hydroxymethyl 3,4-ethylenedioxythiophene):polystyrene sulfonate (PEDOT-MeOH:PSS) and (3-aminopropyl)triethoxysilane is designed. The resultant PEDOT-MeOH:PSS-AgNP composite presents a consistent coating of covalently linked AgNPs, as shown by scanning electron microscopy and surface plasmon resonance analysis. The efficacy of the coatings, with and without electrical addressing, is then tested against Staphylococcus aureus, a major colonizer of medical implants. Using custom-designed culturing devices, a nearly complete prevention of biofilm growth is obtained in AgNP composite devices addressed with a square wave voltage input. It is concluded that this electroenhancement of the bactericidal effect of the coupled AgNPs offers a novel, efficient solution against biofilm colonization of medical implants.

摘要

医院获得性感染的发生率在很大程度上是由于与器械相关的感染。细菌附着和生物膜在医疗器械表面的形成通常是感染的起源。为了预防这种感染,经常使用基于银纳米粒子(AgNPs)的涂层,然而临床成功率各不相同。在这里,传统的基于 AgNP 的抗菌技术被重新构想,现在成为电增强抗菌涂层的基础。为了将 AgNPs 整合到导电聚合物层中,设计了一种基于聚(羟甲基 3,4-亚乙基二氧噻吩):聚苯乙烯磺酸盐(PEDOT-MeOH:PSS)和(3-氨丙基)三乙氧基硅烷的简单而有效的化学策略。扫描电子显微镜和表面等离子体共振分析表明,所得的 PEDOT-MeOH:PSS-AgNP 复合材料呈现出共价连接的 AgNPs 的一致涂层。然后,测试了带有和不带有电寻址的涂层对金黄色葡萄球菌(一种医学植入物的主要定植菌)的功效。使用定制设计的培养装置,在使用方波电压输入寻址的 AgNP 复合装置中,几乎完全阻止了生物膜的生长。结论是,这种电增强耦合 AgNPs 的杀菌效果提供了一种针对医学植入物生物膜定植的新型、高效解决方案。

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