Zhou Wu, Yu Huijun, Peng Bei, Shen Huaqin, He Xiaoping, Su Wei
School of Mechatronics Engineering, University of Electronic Technology and Science of China, Chengdu 611731, China.
Institute of Electronic Engineering, China Academy of Engineering Physics, Mianyang 621900, China.
Materials (Basel). 2013 Jan 15;6(1):244-254. doi: 10.3390/ma6010244.
Microstructure curvature, or buckling, is observed in the micromachining of silicon sensors because of the doping of impurities for realizing certain electrical and mechanical processes. This behavior can be a key source of error in inertial sensors. Therefore, identifying the factors that influence the buckling value is important in designing MEMS devices. In this study, the curvature in the proof mass of an accelerometer is modeled as a multilayered solid model. Modeling is performed according to the characteristics of the solid diffusion mechanism in the bulk-dissolved wafer process (BDWP) based on the self-stopped etch technique. Moreover, the proposed multilayered solid model is established as an equivalent composite structure formed by a group of thin layers that are glued together. Each layer has a different Young's modulus value and each undergoes different volume shrinkage strain owing to boron doping in silicon. Observations of five groups of proof mass blocks of accelerometers suggest that the theoretical model is effective in determining the buckling value of a fabricated structure.
在硅传感器的微加工过程中，由于为实现某些电气和机械工艺而进行杂质掺杂，会观察到微观结构曲率或翘曲现象。这种行为可能是惯性传感器中误差的一个关键来源。因此，确定影响翘曲值的因素对于设计微机电系统（MEMS）器件至关重要。在本研究中，加速度计的检测质量中的曲率被建模为多层固体模型。基于自停止蚀刻技术，根据体溶解晶圆工艺（BDWP）中的固体扩散机制的特点进行建模。此外，所提出的多层固体模型被建立为由一组粘在一起的薄层形成的等效复合结构。每层具有不同的杨氏模量值，并且由于硅中的硼掺杂，每层经历不同的体积收缩应变。对五组加速度计检测质量块的观察表明，该理论模型在确定制造结构的翘曲值方面是有效的。
