Webb J L, Knutsson J, Hjort M, McKibbin S R, Lehmann S, Thelander C, Dick K A, Timm R, Mikkelsen A
Division of Synchrotron Radiation Research, Lund University, Lund, Sweden.
Division of Solid State Physics, Lund University, Lund, Sweden.
Sci Rep. 2017 Oct 6;7(1):12790. doi: 10.1038/s41598-017-13007-w.
As semiconductor electronics keep shrinking, functionality depends on individual atomic scale surface and interface features that may change as voltages are applied. In this work we demonstrate a novel device platform that allows scanning tunneling microscopy (STM) imaging with atomic scale resolution across a device simultaneously with full electrical operation. The platform presents a significant step forward as it allows STM to be performed everywhere on the device surface and high temperature processing in reactive gases of the complete device. We demonstrate the new method through proof of principle measurements on both InAs and GaAs nanowire devices with variable biases up to 4 V. On InAs nanowires we observe a surprising removal of atomic defects and smoothing of the surface morphology under applied bias, in contrast to the expected increase in defects and electromigration-related failure. As we use only standard fabrication and scanning instrumentation our concept is widely applicable and opens up the possibility of fundamental investigations of device surface reliability as well as new electronic functionality based on restructuring during operation.
随着半导体电子器件不断缩小,其功能依赖于单个原子尺度的表面和界面特征,这些特征可能会在施加电压时发生变化。在这项工作中,我们展示了一种新型器件平台,该平台允许在器件全电操作的同时,以原子尺度分辨率对整个器件进行扫描隧道显微镜(STM)成像。该平台向前迈出了重要一步,因为它允许在器件表面的任何位置进行STM操作,并能在反应性气体中对整个器件进行高温处理。我们通过对InAs和GaAs纳米线器件进行原理验证测量(可变偏压高达4 V)来展示这种新方法。在InAs纳米线上,我们观察到在施加偏压时原子缺陷意外地减少,表面形态变得平滑,这与预期的缺陷增加和与电迁移相关的失效情况相反。由于我们仅使用标准制造和扫描仪器,我们的概念具有广泛的适用性,并为基于操作过程中的重组对器件表面可靠性以及新电子功能进行基础研究开辟了可能性。