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多孔 TiO2 涂层中铜纳米粒子对成骨细胞和内皮细胞的抗细菌性能和细胞相容性的影响。

Effects of copper nanoparticles in porous TiO coatings on bacterial resistance and cytocompatibility of osteoblasts and endothelial cells.

机构信息

College of Materials Science and Engineering, Taiyuan University of Technology, Taiyuan, China; Department of Physics and Materials Science, City University of Hong Kong, Tat Chee Avenue, Kowloon, Hong Kong, China.

College of Materials Science and Engineering, Taiyuan University of Technology, Taiyuan, China.

出版信息

Mater Sci Eng C Mater Biol Appl. 2018 Jan 1;82:110-120. doi: 10.1016/j.msec.2017.08.061. Epub 2017 Aug 17.

DOI:10.1016/j.msec.2017.08.061
PMID:29025639
Abstract

Copper (Cu) has garnered increasing interest due to its excellent antimicrobial activity and important roles in human metabolism. Although the biological effects of Cu have been studied, the effects of Cu nanoparticles (NPs) on cell behavior are not well understood. In this study, porous TiO coatings doped with different amounts of Cu NPs (designated as 0 Cu, 0.3 Cu, and 3.0 Cu) are deposited on titanium by micro-arc oxidation (MAO). The Cu NPs coated samples exhibit excellent antibacterial activity against Staphylococcus aureus (S. aureus). In vitro cytocompatibility evaluation discloses that 0 Cu and 0.3 Cu have no toxicity to osteoblasts but 3.0 Cu shows cytotoxicity. 0.3 Cu promotes proliferation and adhesion of osteoblasts and enhances extracellular matrix mineralization (ECM), but has little effects on the alkaline phosphatase activity (ALP) and collagen secretion. Surprisingly, the Cu NPs coated samples show a different behavior with endothelial cells. Both 0.3 Cu and 3.0 Cu show no cytotoxicity on endothelial cells and promote cell proliferation. Production of nitric oxide (NO) and secretion of vascular endothelial growth factor (VEGF) by the endothelial cells are observed from the Cu NPs doped TiO coatings.

摘要

铜(Cu)由于其出色的抗菌活性和在人类新陈代谢中的重要作用而受到越来越多的关注。尽管已经研究了 Cu 的生物学效应,但 Cu 纳米颗粒(NPs)对细胞行为的影响尚不清楚。在这项研究中,通过微弧氧化(MAO)在钛上沉积了不同量的 Cu NPs(分别标记为 0 Cu、0.3 Cu 和 3.0 Cu)的多孔 TiO 涂层。涂覆有 Cu NPs 的样品对金黄色葡萄球菌(S. aureus)表现出优异的抗菌活性。体外细胞相容性评估表明,0 Cu 和 0.3 Cu 对成骨细胞没有毒性,但 3.0 Cu 表现出细胞毒性。0.3 Cu 促进成骨细胞的增殖和黏附,并增强细胞外基质矿化(ECM),但对碱性磷酸酶活性(ALP)和胶原蛋白分泌几乎没有影响。令人惊讶的是,涂覆有 Cu NPs 的样品对内皮细胞表现出不同的行为。0.3 Cu 和 3.0 Cu 对内皮细胞均无细胞毒性,并促进细胞增殖。从掺杂有 Cu NPs 的 TiO 涂层中观察到内皮细胞产生一氧化氮(NO)和分泌血管内皮生长因子(VEGF)。

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