School of Chemistry and Materials Science, Rochester Institute of Technology , Rochester, New York 14623, United States.
Department of Industrial and Systems Engineering, Rochester Institute of Technology , Rochester, New York 14623, United States.
ACS Appl Mater Interfaces. 2018 Jan 31;10(4):3830-3837. doi: 10.1021/acsami.7b19161. Epub 2018 Jan 19.
A solid silver-ligand complex, μ-oxolato-bis(ethylenediaminesilver(I)), was developed for formulating particle-free conductive metal-organic decomposition (MOD) inkjet inks. The complex comprises both a high molar silver content and solubility in inkjet compatible polar solvents. An aqueous ink formulation with 29.5 wt % silver content was developed and inkjet printed onto glass, polyethylene terephthalate, and polyimide substrates. A new hybrid thermal-photonic curing approach resulting in substantially improved electrical properties and substrate adhesion is presented. Silver conductive traces were measured to have bulk resistivity of 4.26 × 10 Ω m, which is 2.7 times that of bulk silver. One-pot complex synthesis yielded an easily isolated, and stable, solid product that can be formulated when needed thereby improving shelf life.
一种固态银配体配合物，μ-氧代双（乙二胺合银（I）），被开发用于配制无颗粒导电金属有机分解（MOD）喷墨油墨。该配合物既具有高摩尔银含量，又可溶于喷墨兼容的极性溶剂中。开发了一种含 29.5wt%银的水性油墨配方，并喷墨打印到玻璃、聚对苯二甲酸乙二醇酯和聚酰亚胺基底上。提出了一种新的混合热-光子固化方法，可显著改善电性能和基底附着力。银导电迹线的体电阻率测量值为 4.26×10 Ω·m，是块状银的 2.7 倍。一锅法合成得到了一种易于分离和稳定的固体产物，可按需配制，从而提高了保质期。
