Xiao Peng, Zhou Yicong, Gan Liao, Pan Zhipeng, Chen Jianwen, Luo Dongxiang, Yao Rihui, Chen Jianqiu, Liang Hongfu, Ning Honglong
School of Physics and Optoelectronic Engineering, Foshan University, Foshan 528000, China.
Institute of Polymer Optoelectronic Materials and Devices, State Key Laboratory of Luminescent Materials and Devices, South China University of Technology, Guangzhou 510640, China.
Micromachines (Basel). 2020 Jul 12;11(7):677. doi: 10.3390/mi11070677.
Currently, inkjet printing conductive films have attracted more and more attention in the field of electronic device. Here, the inkjet-printed silver thin films based on nanoparticles (NP) ink and metal-organic decomposition (MOD) ink were cured by the UV curing method and heat curing method. We not only compared the electrical resistivity and adhesion strength of two types of silver films, but also studied the effect of different curing methods on silver films. The silver films based on NP ink had good adhesion strength with a lowest electrical resistivity of 3.7 × 10 Ω·m. However, the silver film based on MOD ink had terrible adhesion strength with a lowest electrical resistivity of 2 × 10 Ω·m. Furthermore, we found a simple way to improve the terrible adhesion strength of silver films based on MOD ink and tried to figure out the mechanisms. This work offers a further understanding of the different performances of two types of silver films with different curing methods.
目前，喷墨打印导电薄膜在电子器件领域已引起越来越多的关注。在此，基于纳米颗粒（NP）墨水和金属有机分解（MOD）墨水的喷墨打印银薄膜通过紫外固化法和热固化法进行固化。我们不仅比较了两种类型银薄膜的电阻率和附着力强度，还研究了不同固化方法对银薄膜的影响。基于NP墨水的银薄膜具有良好的附着力强度，最低电阻率为3.7×10Ω·m。然而，基于MOD墨水的银薄膜附着力很差，最低电阻率为2×10Ω·m。此外，我们找到了一种改善基于MOD墨水的银薄膜附着力差的简单方法，并试图弄清楚其机理。这项工作有助于进一步了解两种采用不同固化方法的银薄膜的不同性能。
