Toodehzaeim Mohammad Hossein, Zandi Hengameh, Meshkani Hamidreza, Hosseinzadeh Firouzabadi Azadeh
Dept. of Orthodontics, School of Dentistry, Shahid Sadoughi University of Medical Sciences, Yazd, Iran.
Dept. of Microbiology, School of Medicine, Shahid Sadoughi University of Medical Sciences, Yazd, Iran.
J Dent (Shiraz). 2018 Mar;19(1):1-5.
Orthodontic appliances facilitate microbial plaque accumulation and increase the chance of white spot lesions. There is a need for new plaque control methods independent of patient's cooperation.
The aim of this study was to determine the effects of incorporating copper oxide (CuO) nanoparticles on antimicrobial properties and bond strength of orthodontic adhesive.
CuO nanoparticles were added to the composite transbond XT at concentrations of 0.01, 0.5 and 1 wt.%. To evaluate the antimicrobial properties of composites containing nanoparticles, the disk agar diffusion test was used. For this purpose, 10 discs from each concentration of nano-composites (totally 30 discs) and 10 discs from conventional composite (as the control group) were prepared. Then the diameter of growth inhibition around each disc was determined in blood agar medium. To evaluate the shear bond strength, with each concentration of nano-composites as well as the control group (conventional composite), 10 metal brackets were bonded to the human premolars and shear bond strength was determined using a universal testing machine.
Nano-composites in all three concentrations showed significant antimicrobial effect compared to the control group (< 0.001). With increasing concentration of nanoparticles, antimicrobial effect showed an upward trend, although statistically was not significant. There was no significant difference between the shear bond strength of nano-composites compared to control group (= 0.695).
Incorporating CuO nanoparticles into adhesive in all three studied concentrations added antimicrobial effects to the adhesive with no adverse effects on shear bond strength.
正畸矫治器会促进微生物菌斑积聚，并增加出现白斑病变的几率。因此，需要有独立于患者配合的新型菌斑控制方法。
本研究的目的是确定添加氧化铜（CuO）纳米颗粒对正畸粘合剂抗菌性能和粘结强度的影响。
将CuO纳米颗粒以0.01%、0.5%和1%（重量）的浓度添加到复合正畸粘合剂Transbond XT中。为评估含纳米颗粒复合材料的抗菌性能，采用了纸片琼脂扩散试验。为此，制备了每种纳米复合材料浓度的10个圆盘（共30个圆盘）以及常规复合材料的10个圆盘（作为对照组）。然后在血琼脂培养基中测定每个圆盘周围的抑菌圈直径。为评估剪切粘结强度，将每种纳米复合材料浓度以及对照组（常规复合材料）的10个金属托槽粘结到人前磨牙上，并使用万能试验机测定剪切粘结强度。
与对照组相比，所有三种浓度的纳米复合材料均显示出显著的抗菌效果（<0.001）。随着纳米颗粒浓度的增加，抗菌效果呈上升趋势，尽管在统计学上不显著。与对照组相比，纳米复合材料的剪切粘结强度没有显著差异（P = 0.695）。
在所有三种研究浓度下，将CuO纳米颗粒加入粘合剂中，可使粘合剂具有抗菌效果，且对剪切粘结强度无不利影响。
