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重硼掺杂硅的退火:对电学和热电性能的影响。

Annealing of Heavily Boron-Doped Silicon: Effect on Electrical and Thermoelectric Properties.

作者信息

Zulian Laura, Segrado Francesco, Narducci Dario

出版信息

J Nanosci Nanotechnol. 2017 Mar;17(3):1657-662. doi: 10.1166/jnn.2017.13725.

DOI:10.1166/jnn.2017.13725
PMID:29697242
Abstract

In previous studies it was shown that heavily boron-doped nanocrystalline silicon submitted to thermal treatments at temperatures ≥800 °C is characterized by an anomalously high thermoelectric power factor. Its enhanced performances were ascribed to the formation of SiBx precipitates at grain boundary, leading to the formation of potential barriers that filter out low-energy carriers, then causing a simultaneous enhancement of the Seebeck coefficient and of the electrical conductivity. To further investigate the effect of thermal treatment on boron-doped nanocrystalline silicon, samples were submitted to a host of annealing processes or of sequences of them at temperatures between 900 and 1000 °C and for various amounts of time. Electrical conductivity and Hall effect measurements were carried out after each thermal treatment over the temperature range 20–300 K. They provided evidence of the formation of an impurity band, and of hopping conduction at very low temperatures. Hall resistivity data versus temperature provided therefore important insights in the electronic structure of the system, which will enable a more complete understanding of the factors ruling energy filtering in this class of materials.

摘要

在先前的研究中表明,在温度≥800°C下进行热处理的重硼掺杂纳米晶硅具有异常高的热电功率因数。其性能的增强归因于在晶界处形成SiBx沉淀物,导致形成过滤低能量载流子的势垒,进而同时提高了塞贝克系数和电导率。为了进一步研究热处理对硼掺杂纳米晶硅的影响,将样品在900至1000°C的温度下进行了一系列退火过程或其序列,并持续不同的时间。在每次热处理后,在20 - 300 K的温度范围内进行电导率和霍尔效应测量。这些测量提供了杂质带形成以及在非常低的温度下跳跃传导的证据。因此,霍尔电阻率数据与温度的关系为该系统的电子结构提供了重要的见解,这将有助于更全面地理解控制这类材料中能量过滤的因素。

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引用本文的文献

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Materials (Basel). 2021 Sep 14;14(18):5305. doi: 10.3390/ma14185305.