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多胺对镉和铜介导的小麦(Triticum aestivum L)和向日葵(Helianthus annuus L)幼苗膜流动性变化的影响。

Effects of polyamines on cadmium- and copper-mediated alterations in wheat (Triticum aestivum L) and sunflower (Helianthus annuus L) seedling membrane fluidity.

机构信息

Universidad de Buenos Aires, Consejo Nacional de Investigaciones Científicas y Técnicas (CONICET), Instituto de Química y Fisicoquímica Biológicas (IQUIFIB), Facultad de Farmacia y Bioquímica, Buenos Aires, Argentina.

Universidad de Buenos Aires, Consejo Nacional de Investigaciones Científicas y Técnicas (CONICET), Instituto de Química y Fisicoquímica Biológicas (IQUIFIB), Facultad de Farmacia y Bioquímica, Buenos Aires, Argentina.

出版信息

Arch Biochem Biophys. 2018 Sep 15;654:27-39. doi: 10.1016/j.abb.2018.07.008. Epub 2018 Jul 11.

Abstract

We investigated if wheat (Wh) and sunflower (Sf) plants watering with 1 mM CdCl or CuCl for 5-15 d during germination and seedling altered membrane fluidity (MF) of their leaves and roots, and if plant pre-treatment with the polyamines (PAs) putrescine (Put), spermidine (Spd) or spermine (Spm) prevented those alterations. Cd impaired Wh and Sf growth, while Cu only affected Sf growth. Cu and Cd increased MF of leaves of both plant species, while Cd decreased MF of Sf roots. Plant treatment for 15 d with 0.1 mM Put, Spd or Spm did not affect plant growth and had opposed effects on the MF of both plants. Finally, Wh and Sf were pre-treated with PAs for either 5 or 10 days followed by metal treatment until day 15. While Put did not affect membrane MF, Spd and Spm decreased it between 5 and 10 d of plant treatment. Together, experimental results demonstrate that during plant development (a) Cd and Cu have noxious effects on plants membrane biophysical properties that could be partially responsible of their toxicity, and (b) this deleterious effect could be only partially prevented by plant pretreatment with the PAs.

摘要

我们研究了在发芽和幼苗期用 1mM CdCl 或 CuCl 对小麦(Wh)和向日葵(Sf)植株浇水 5-15 天是否会改变它们叶片和根部的膜流动性(MF),以及植物预先用多胺(PAs)腐胺(Put)、亚精胺(Spd)或精胺(Spm)处理是否可以防止这些变化。Cd 会损害 Wh 和 Sf 的生长,而 Cu 仅影响 Sf 的生长。Cu 和 Cd 增加了两种植物叶片的 MF,而 Cd 降低了 Sf 根部的 MF。用 0.1mM Put、Spd 或 Spm 处理 15 天不会影响植物生长,对两种植物的 MF 均有相反的影响。最后,Wh 和 Sf 用 PAs 预处理 5 或 10 天,然后用金属处理至第 15 天。虽然 Put 不影响膜 MF,但 Spd 和 Spm 在植物处理 5-10 天之间降低了 MF。总之,实验结果表明,在植物发育过程中,(a)Cd 和 Cu 对植物膜生物物理性质具有有害影响,这可能是它们毒性的部分原因,(b)这种有害影响可以通过植物用 PAs 预处理来部分预防。

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