Department of Electrical and Computer Engineering, Seoul National University, Gwanak-Gu Gwanakro 1, Seoul 08826, Korea.
Jiangsu Key Laboratory of Spectral Imaging & Intelligent Sense, Nanjing University of Science and Technology, Nanjing 210094, China.
Sensors (Basel). 2018 Oct 31;18(11):3711. doi: 10.3390/s18113711.
Three-dimensional (3D) imaging has attracted more and more interest because of its widespread applications, especially in information and life science. These techniques can be broadly divided into two types: ray-based and wavefront-based 3D imaging. Issues such as imaging quality and system complexity of these techniques limit the applications significantly, and therefore many investigations have focused on 3D imaging from depth measurements. This paper presents an overview of 3D imaging from depth measurements, and provides a summary of the connection between the ray-based and wavefront-based 3D imaging techniques.
三维(3D)成像由于其广泛的应用而引起了越来越多的关注,特别是在信息和生命科学领域。这些技术可以大致分为两类:基于射线的和基于波前的 3D 成像。这些技术的成像质量和系统复杂性等问题显著限制了它们的应用,因此许多研究都集中在基于深度测量的 3D 成像上。本文对基于深度测量的 3D 成像进行了综述,并对基于射线的和基于波前的 3D 成像技术之间的联系进行了总结。