Wang Junyao, Han Lu-Lu, Sun Ye-Ming, Su Tian-Yi
School of Mechanical Engineering, Northeast Electric Power University, Jilin 132012, China.
School of Mechanic Engineering, Jilin University, Changchun 130000, China.
Micromachines (Basel). 2018 Nov 24;9(12):621. doi: 10.3390/mi9120621.
In this paper, a direct pre-bonding technology after alignment of the chip is presented to avoid the post-misalignment problem caused by the transferring process from an alignment platform to a heating oven. An alignment system with a high integration level including a microscope device, a vacuum device, and an alignment device is investigated. To align the chip, a method of 'fixing a chip with microchannels and moving a chip with nanochannels' is adopted based on the alignment system. With the alignment system and the assembly method, the micro/nanofluidic chip was manufactured with little time and low cost. Furthermore, to verify the performance of the chip and then confirm the practicability of the device, an ion enrichment experiment is carried out. The results demonstrate that the concentration of fluorescein isothiocyanate (FITC) reaches an enrichment value of around 5 μM and the highest enrichment factor is about 500-fold. Compared with other devices, an alignment system presented in this paper has the advantages of direct pre-bonding and high integration level.
本文提出了一种芯片对准后的直接预键合技术，以避免从对准平台转移到加热炉的过程中产生的对准后失调问题。研究了一种具有高集成度的对准系统，该系统包括显微镜装置、真空装置和对准装置。为了对准芯片，基于该对准系统采用了“固定带有微通道的芯片并移动带有纳米通道的芯片”的方法。利用该对准系统和组装方法，以较少的时间和较低的成本制造了微/纳流体芯片。此外，为了验证芯片的性能并进而确认该装置的实用性，进行了离子富集实验。结果表明，异硫氰酸荧光素（FITC）的浓度达到约5μM的富集值，最高富集因子约为500倍。与其他装置相比，本文提出的对准系统具有直接预键合和高集成度的优点。
