Göktaş Hasan
Electrical and Electronic Engineering, Harran University, Şanlıurfa 63000, Turkey.
Micromachines (Basel). 2019 Feb 6;10(2):108. doi: 10.3390/mi10020108.
Microbolometers and photon detectors are two main technologies to address the needs in Infrared Sensing applications. While the microbolometers in both complementary metal-oxide semiconductor (CMOS) and Micro-Electro-Mechanical Systems (MEMS) technology offer many advantages over photon detectors, they still suffer from nonlinearity and relatively low temperature sensitivity. This paper not only offers a reliable solution to solve the nonlinearity problem but also demonstrate a noticeable potential to build ultra-sensitive CMOS⁻MEMS temperature sensor for infrared (IR) sensing applications. The possibility of a 31× improvement in the total absolute frequency shift with respect to ambient temperature change is verified via both COMSOL (multiphysics solver) and theory. Nonlinearity problem is resolved by an operating temperature sensor around the beam bending point. The effect of both pull-in force and dimensional change is analyzed in depth, and a drastic increase in performance is achieved when the applied pull-in force between adjacent beams is kept as small as possible. The optimum structure is derived with a length of 57 µm and a thickness of 1 µm while avoiding critical temperature and, consequently, device failure. Moreover, a good match between theory and COMSOL is demonstrated, and this can be used as a guidance to build state-of-the-art designs.
微测辐射热计和光子探测器是满足红外传感应用需求的两种主要技术。虽然互补金属氧化物半导体（CMOS）和微机电系统（MEMS）技术中的微测辐射热计相对于光子探测器具有许多优势，但它们仍然存在非线性和相对较低的温度灵敏度问题。本文不仅提供了一种可靠的解决方案来解决非线性问题，还展示了构建用于红外（IR）传感应用的超灵敏CMOS-MEMS温度传感器的显著潜力。通过COMSOL（多物理场求解器）和理论验证了相对于环境温度变化总绝对频移提高31倍的可能性。通过在梁弯曲点附近操作温度传感器解决了非线性问题。深入分析了拉入力和尺寸变化的影响，当相邻梁之间施加的拉入力尽可能小时，性能实现了大幅提升。得出了长度为57 µm、厚度为1 µm的最佳结构，同时避免了临界温度，从而避免了器件故障。此外，还展示了理论与COMSOL之间的良好匹配，这可作为构建先进设计的指导。
