Physikalisches Institut, Westfälische Wilhelms-Universität, Wilhelm-Klemm-Straße 10, 48149, Münster, Germany.
Center for Nanotechnology, Heisenbergstraße 11, 48149, Münster, Germany.
Adv Mater. 2019 Apr;31(15):e1806070. doi: 10.1002/adma.201806070. Epub 2019 Feb 14.
Polymeric dielectrics play a key role in the realization of flexible organic electronics, especially for the fabrication of scalable device arrays and integrated circuits. Among a wide variety of polymeric dielectric materials, aromatic polyimides (PIs) are flexible, lightweight, and strongly resistant to high-temperature processing and corrosive etchants and, therefore, have become promising candidates as gate dielectrics with good feasibility in manufacturing organic electronic devices. More significantly, the characteristics of PIs can be conveniently modulated by the design of their chemical structures. Herein, from the perspective of structure optimization and interface engineering, a brief overview of recent progress in PI-based dielectrics for organic electronic devices and circuits is provided. Also, an outlook of future research directions and challenges for polyimide dielectric materials is presented.
聚合物电介质在实现柔性有机电子学中起着关键作用，特别是对于可扩展器件阵列和集成电路的制造。在各种各样的聚合物介电材料中，芳香族聚酰亚胺（PI）具有柔韧性、重量轻且对高温处理和腐蚀性蚀刻剂具有很强的抵抗力，因此已成为作为栅介质的有前途的候选材料，在制造有机电子设备方面具有良好的可行性。更重要的是，PI 的特性可以通过其化学结构的设计来方便地调节。在此，从结构优化和界面工程的角度，简要综述了用于有机电子器件和电路的基于 PI 的介电材料的最新进展。还提出了对聚酰亚胺介电材料未来研究方向和挑战的展望。
