Li An, Zhang Cong, Zhang Yang-Fei
Department of Materials Science and Engineering, College of Engineering, Peking University, Beijing 100871, China.
Polymers (Basel). 2017 Sep 15;9(9):437. doi: 10.3390/polym9090437.
With the integration and miniaturization of electronic devices, thermal management has become a crucial issue that strongly affects their performance, reliability, and lifetime. One of the current interests in polymer-based composites is thermal conductive composites that dissipate the thermal energy produced by electronic, optoelectronic, and photonic devices and systems. Ultrahigh thermal conductivity makes graphene the most promising filler for thermal conductive composites. This article reviews the mechanisms of thermal conduction, the recent advances, and the influencing factors on graphene-polymer composites (GPC). In the end, we also discuss the applications of GPC in thermal engineering. This article summarizes the research on graphene-polymer thermal conductive composites in recent years and provides guidance on the preparation of composites with high thermal conductivity.
随着电子设备的集成化和小型化,热管理已成为一个关键问题,严重影响其性能、可靠性和使用寿命。当前对聚合物基复合材料的关注之一是导热复合材料,其可消散电子、光电子和光子器件及系统产生的热能。超高的热导率使石墨烯成为导热复合材料最有前景的填料。本文综述了热传导机制、最新进展以及对石墨烯-聚合物复合材料(GPC)的影响因素。最后,我们还讨论了GPC在热工程中的应用。本文总结了近年来石墨烯-聚合物导热复合材料的研究,并为制备高导热复合材料提供指导。