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为亚微米级串联电子器件赋予聚合物半导体正交性的通用方法。

Universal Route to Impart Orthogonality to Polymer Semiconductors for Sub-Micrometer Tandem Electronics.

作者信息

Park Han Wool, Choi Keun-Yeong, Shin Jihye, Kang Boseok, Hwang Haejung, Choi Shinyoung, Song Aeran, Kim Jaehee, Kweon Hyukmin, Kim Seunghan, Chung Kwun-Bum, Kim BongSoo, Cho Kilwon, Kwon Soon-Ki, Kim Yun-Hi, Kang Moon Sung, Lee Hojin, Kim Do Hwan

机构信息

Department of Chemical Engineering, Hanyang University, Seoul, 04763, Republic of Korea.

School of Electronic Engineering, Soongsil University, Seoul, 06978, Republic of Korea.

出版信息

Adv Mater. 2019 Jul;31(28):e1901400. doi: 10.1002/adma.201901400. Epub 2019 May 7.

DOI:10.1002/adma.201901400
PMID:31063271
Abstract

A universal method that enables utilization of conventional photolithography for processing a variety of polymer semiconductors is developed. The method relies on imparting chemical and physical orthogonality to a polymer film via formation of a semi-interpenetrating diphasic polymer network with a bridged polysilsesquioxane structure, which is termed an orthogonal polymer semiconductor gel. The synthesized gel films remain tolerant to various chemical and physical etching processes involved in photolithography, thereby facilitating fabrication of high-resolution patterns of polymer semiconductors. This method is utilized for fabricating tandem electronics, including pn-complementary inverter logic devices and pixelated polymer light-emitting diodes, which require deposition of multiple polymer semiconductors through solution processes. This novel and universal method is expected to significantly influence the development of advanced polymer electronics requiring sub-micrometer tandem structures.

摘要

开发出一种通用方法,可利用传统光刻技术来处理多种聚合物半导体。该方法通过形成具有桥连聚倍半硅氧烷结构的半互穿双相聚合物网络,赋予聚合物薄膜化学和物理正交性,这种网络被称为正交聚合物半导体凝胶。合成的凝胶薄膜对光刻中涉及的各种化学和物理蚀刻工艺具有耐受性,从而便于制造聚合物半导体的高分辨率图案。该方法用于制造串联电子器件,包括pn互补逆变器逻辑器件和像素化聚合物发光二极管,这些器件需要通过溶液工艺沉积多种聚合物半导体。这种新颖的通用方法有望对需要亚微米级串联结构的先进聚合物电子学的发展产生重大影响。

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