Zou Xiaolong, Liu Mingjie, Yakobson Boris I
Department of Materials Science and NanoEngineering, Department of Chemistry, and the Smalley Institute for Nanoscale Science and Technology, Rice University, Houston, TX, 77005, USA.
Shenzhen Geim Graphene Research Center and Low-dimensional Materials and Devices Laboratory, Tsinghua-Berkeley Shenzhen Institute, Tsinghua University, Shenzhen, Guangdong, 518055, P. R. China.
Small. 2019 Jul;15(27):e1805145. doi: 10.1002/smll.201805145. Epub 2019 May 21.
Migration of dislocations not only determines the durability of large-scale nanoelectronic and opto-electronic devices based on polycrystalline 2D transition-metal dichalcogenides (TMDCs), but also plays an important role in enhancing the performance of novel memristors. However, a fundamental question of the migration dependence on the electronic effects, which are inevitable in practical field-effect transistors based on 2D TMDCs, and its interplay with different dislocations, remains unexplored. Here, taking WS as an example, first-principle calculations are used to show that the electronic contributions arising from defect states can greatly influence the migration barriers of dislocations. The barrier height can be reduced by as much as 50%, which is mainly attributed to the change in electronic occupation and the band energy of defect levels controlled by electronic chemical potential (Fermi level). The reduced barriers in turn lead to significantly enhanced migration, and thus the plasticity. Since defect levels from dislocations locate deep inside the bandgap, the doping-induced tuning of barrier height can be achieved at relatively low doping concentration through either chemical doping or electrode gating. The effective electromechanical coupling in 2D TMDCs can provide new opportunities in material engineering for various potential applications.
位错迁移不仅决定了基于多晶二维过渡金属二硫属化物(TMDCs)的大规模纳米电子和光电器件的耐久性,而且在提高新型忆阻器的性能方面也起着重要作用。然而,在基于二维TMDCs的实际场效应晶体管中不可避免的电子效应与位错迁移的相关性及其与不同位错的相互作用这一基本问题仍未得到探索。在此,以WS为例,第一性原理计算表明,缺陷态产生的电子贡献会极大地影响位错的迁移势垒。势垒高度可降低多达50%,这主要归因于电子占据的变化以及由电化学势(费米能级)控制的缺陷能级的能带能量变化。降低的势垒进而导致迁移显著增强,从而使可塑性增强。由于位错的缺陷能级位于带隙深处,通过化学掺杂或电极门控在相对较低的掺杂浓度下即可实现对势垒高度的掺杂诱导调控。二维TMDCs中有效的机电耦合可为各种潜在应用的材料工程提供新机遇。