Gong Shu, Yap Lim Wei, Zhu Bowen, Cheng Wenlong
Department of Chemical Engineering, Monash University, Clayton, Victoria, 3800, Australia.
The Melbourne Centre for Nanofabrication, Clayton, 151 Wellington Road, Victoria, 3800, Australia.
Adv Mater. 2020 Apr;32(15):e1902278. doi: 10.1002/adma.201902278. Epub 2019 Aug 29.
Emerging next-generation soft electronics will require versatile properties functioning under mechanical compliance, which will involve the use of different types of materials. As a result, control over material interfaces (particularly soft/hard interfaces) has become crucial and is now attracting intensive worldwide research efforts. A series of material and structural interface designs has been devised to improve interfacial adhesion, preventing failure of electromechanical properties under mechanical deformation. Herein, different soft/hard interface design strategies at multiple length scales in the context of flexible hybrid electronics are reviewed. The crucial role of soft ligands and/or polymers in controlling the morphologies of active nanomaterials and stabilizing them is discussed, with a focus on understanding the soft/hard interface at the atomic/molecular scale. Larger nanoscopic and microscopic levels are also discussed, to scrutinize viable intrinsic and extrinsic interfacial designs with the purpose of promoting adhesion, stretchability, and durability. Furthermore, the macroscopic device/human interface as it relates to real-world applications is analyzed. Finally, a perspective on the current challenges and future opportunities in the development of truly seamlessly integrated soft wearable electronic systems is presented.
新兴的下一代柔性电子器件将需要在机械柔顺性下发挥作用的多功能特性，这将涉及使用不同类型的材料。因此，对材料界面（特别是软/硬界面）的控制已变得至关重要，并且目前正吸引着全球范围内的密集研究努力。人们已经设计出一系列材料和结构界面设计，以改善界面粘附性，防止在机械变形下机电性能失效。在此，本文综述了在柔性混合电子学背景下多种长度尺度的不同软/硬界面设计策略。讨论了软配体和/或聚合物在控制活性纳米材料形态和稳定它们方面的关键作用，重点是在原子/分子尺度上理解软/硬界面。还讨论了更大的纳米和微观层面，以仔细研究可行的本征和非本征界面设计，目的是提高粘附性、拉伸性和耐久性。此外，还分析了与实际应用相关的宏观器件/人体界面。最后，对真正无缝集成的可穿戴软电子系统开发中的当前挑战和未来机遇提出了展望。
