Himori Shogo, Takahashi Riku, Tanaka Aya, Yamaguchi Masumi
NTT Basic Research Laboratories and Bio-Medical Informatics Research Center, NTT Corporation, 3-1 Morinosato Wakamiya, Atsugi, Kanagawa 243-0198, Japan.
ACS Omega. 2024 Oct 6;9(41):42261-42266. doi: 10.1021/acsomega.4c04774. eCollection 2024 Oct 15.
Composites of hydrogels and metals are gaining interest because of each material's unique properties. However, the stable adhesion of metals on hydrogels is challenging due to the mechanical mismatch at the soft-hard interface and the liquidity of the water components in hydrogels. We propose a facile physical-adhesion method that involves the dehydration process of hydrogels to transfer metals from a glass substrate. This method is based on the hydrophobic interaction between polymer chains and metals and is stable, even in water. Continuous metal wiring was achieved on a swollen hydrogel, and electrical conduction was effective for a soft electronic device. Therefore, our method could be a versatile method for integrating hydrogels and metals.
水凝胶与金属的复合材料因其各自独特的性能而备受关注。然而，由于软硬界面处的机械不匹配以及水凝胶中水成分的流动性，金属在水凝胶上的稳定粘附具有挑战性。我们提出了一种简便的物理粘附方法，该方法涉及水凝胶的脱水过程，以从玻璃基板转移金属。此方法基于聚合物链与金属之间的疏水相互作用，即使在水中也很稳定。在溶胀的水凝胶上实现了连续的金属布线，并且对软电子器件的导电效果良好。因此，我们的方法可能是一种用于整合水凝胶和金属的通用方法。
