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厚样品深度切片扫描透射电子显微镜分析及三维成像

Analysis of depth-sectioning STEM for thick samples and 3D imaging.

作者信息

Bosch Eric G T, Lazić Ivan

机构信息

Thermo Fisher Scientific, Achtseweg, Noord 5, 5651GG Eindhoven, NOORD-BRABANT, the Netherlands.

Thermo Fisher Scientific, Achtseweg, Noord 5, 5651GG Eindhoven, NOORD-BRABANT, the Netherlands.

出版信息

Ultramicroscopy. 2019 Dec;207:112831. doi: 10.1016/j.ultramic.2019.112831. Epub 2019 Aug 24.

DOI:10.1016/j.ultramic.2019.112831
PMID:31491735
Abstract

We derive a model that describes 3D volume imaging in depth-sectioning STEM that is valid for all STEM techniques under three well-defined conditions: linearity, undisturbed probe and elastic scattering. The resulting undisturbed probe model generalizes the widely used idea that the undisturbed probe intensity in three dimensions can be used as the point spread function for depth-sectioning ADF-STEM to all STEM techniques including (A)BF- and iDPC-STEM. The model provides closed expressions for depth-sectioning STEM, which follow directly from the 2D expressions for thin samples, and thereby enables analysis of the 3D resolution. Using the model we explore the consequences of the resulting 3D contrast transfer function (CTF) for the z-resolution at different length scales and illustrate this with experiments. We investigate the validity and limitations of the model using multi-slice simulations showing that it is valid and quantitatively accurate for relatively thick amorphous samples but not for crystalline samples in zone-axis due to channeling. We compare depth-sectioning in iDPC- and ADF-STEM and show that iDPC-STEM can extract information from deeper into the sample, all the way till the bottom of the sample, thereby effectively allowing a thickness measurement. Also the difference in optimal focus conditions between iDPC- and ADF-STEM is explained. Finally, we propose practical criteria for deciding whether a sample is thin or thick.

摘要

我们推导了一个模型,该模型描述了深度切片扫描透射电子显微镜(STEM)中的三维体积成像,在三个明确的条件下对所有STEM技术均有效:线性、未受干扰的探针和弹性散射。所得的未受干扰探针模型将广泛使用的概念进行了推广,即三维中未受干扰的探针强度可作为深度切片环形暗场STEM(ADF-STEM)的点扩散函数,推广到包括(高角度)明亮场(A)BF-STEM和差分相位衬度(iDPC)-STEM在内的所有STEM技术。该模型提供了深度切片STEM的封闭表达式,这些表达式直接源于薄样品的二维表达式,从而能够分析三维分辨率。使用该模型,我们探讨了所得三维对比度传递函数(CTF)在不同长度尺度下对z分辨率的影响,并通过实验进行了说明。我们使用多切片模拟研究了该模型的有效性和局限性,结果表明,对于相对较厚的非晶样品,该模型是有效且定量准确的,但对于沿晶带轴的晶体样品,由于沟道效应,该模型无效。我们比较了iDPC-STEM和ADF-STEM中的深度切片,结果表明,iDPC-STEM可以从样品更深的位置提取信息,一直到样品底部,从而有效地实现厚度测量。此外,还解释了iDPC-STEM和ADF-STEM在最佳聚焦条件上的差异。最后,我们提出了判断样品是薄还是厚的实用标准。

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