Frigg Andreas, Boes Andreas, Ren Guanghui, Abdo Islam, Choi Duk-Yong, Gees Silvio, Mitchell Arnan
Opt Express. 2019 Dec 23;27(26):37795-37805. doi: 10.1364/OE.380758.
Low temperature deposition of low loss silicon nitride (SiN) thin-films is very attractive as it opens opportunities for realization of multi-layer photonic chips and hybrid integration of optical waveguides with temperature sensitive platforms such as processed CMOS silicon electronics or lithium niobate on insulator. So far, the most common low-temperature deposition technique for SiN is plasma enhanced chemical vapor deposition (PECVD), however such SiN thin-films can suffer from significant losses at C-band wavelengths due to unwanted hydrogen bonds. In this contribution we present a back end of line (< 400°C), low loss SiN platform based on reactive sputtering for telecommunication applications. Waveguide losses of 0.8 dB/cm at 1550 nm and as low as 0.6 dB/cm at 1580 nm have been achieved for moderate confined waveguides which appear to be limited by patterning rather than material. These findings show that reactive sputtered SiN thin-films can have lower optical losses compared to PECVD SiN thin-films, and thus show promise for future hybrid integration platforms for applications such as high Q resonators, optical filters and delay lines for optical signal processing.
低温沉积低损耗氮化硅(SiN)薄膜极具吸引力,因为它为实现多层光子芯片以及光波导与温度敏感平台(如经过处理的CMOS硅电子器件或绝缘体上的铌酸锂)的混合集成提供了机会。到目前为止,用于SiN的最常见低温沉积技术是等离子体增强化学气相沉积(PECVD),然而,由于不需要的氢键,这种SiN薄膜在C波段波长下可能会遭受显著的损耗。在本论文中,我们展示了一种基于反应溅射的用于电信应用的后端线路(<400°C)低损耗SiN平台。对于中等限制的波导,在1550 nm处实现了0.8 dB/cm的波导损耗,在1580 nm处低至0.6 dB/cm,这些损耗似乎受图案化而非材料的限制。这些发现表明,与PECVD SiN薄膜相比,反应溅射的SiN薄膜可以具有更低的光学损耗,因此对于诸如高Q谐振器、光学滤波器和光信号处理延迟线等应用的未来混合集成平台具有前景。