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通过背散射电子的角度过滤提高电子背散射对比成像中的缺陷对比度。

Enhancing the defect contrast in ECCI through angular filtering of BSEs.

作者信息

Han Han, Hantschel Thomas, Schulze Andreas, Strakos Libor, Vystavel Tomas, Loo Roger, Kunert Bernardette, Langer Robert, Vandervorst Wilfried, Caymax Matty

机构信息

imec, Kapeldreef 75, Leuven 3001, Belgium; Dept. of Physics and Astronomy, KU Leuven, Celestijnenlaan 200D, Leuven 3001, Belgium.

imec, Kapeldreef 75, Leuven 3001, Belgium.

出版信息

Ultramicroscopy. 2020 Mar;210:112922. doi: 10.1016/j.ultramic.2019.112922. Epub 2019 Dec 24.

Abstract

In this study, an annular multi-segment backscattered electron (BSE) detector is used in back scatter geometry to investigate the influence of the angular distribution of BSE on the crystalline defect contrast in electron channeling contrast imaging (ECCI). The study is carried out on GaAs and Ge layers epitaxially grown on top of silicon (Si) substrates, respectively. The influence of the BSE detection angle and landing energy are studied to identify the optimal ECCI conditions. It is demonstrated that the angular selection of BSEs exhibits strong effects on defect contrast formation with variation of beam energies. In our study, maximum defect contrast can be obtained at BSE detection angles 53-65° for the investigated energies 5, 10 and 20 keV. In addition, it is found that higher beam energy is favorable to reveal defects with stronger contrast whereas lower energy ( ≤ 5 keV) is favorable for revealing crystalline defects as well as with topographic features on the surface. Our study provides optimal ECCI conditions, and therefore enables a precise and fast detection of threading dislocations in lowly defective materials and nanoscale 3D semiconductor structures where signal to noise ratio is especially important. A comparison of ECCI with BSE and secondary electron imaging further demonstrates the strength of ECCI in term of simultaneous detection of defects and morphology features such as terraces with atomic step heights.

摘要

在本研究中,使用环形多段背散射电子(BSE)探测器在背散射几何条件下研究背散射电子的角分布对电子通道衬度成像(ECCI)中晶体缺陷衬度的影响。该研究分别在硅(Si)衬底上外延生长的砷化镓(GaAs)和锗(Ge)层上进行。研究了BSE检测角度和着陆能量的影响,以确定最佳的ECCI条件。结果表明,随着束流能量的变化,BSE的角度选择对缺陷衬度形成有强烈影响。在我们的研究中,对于5、10和20 keV的研究能量,在BSE检测角度为53 - 65°时可获得最大缺陷衬度。此外,发现较高的束流能量有利于揭示对比度更强的缺陷,而较低的能量(≤5 keV)有利于揭示晶体缺陷以及表面的形貌特征。我们的研究提供了最佳的ECCI条件,因此能够在低缺陷材料和纳米级3D半导体结构中精确快速地检测穿透位错,在这些结构中,信噪比尤为重要。ECCI与BSE和二次电子成像的比较进一步证明了ECCI在同时检测缺陷和形貌特征(如具有原子台阶高度的平台)方面的优势。

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