Gaudiuso Caterina, Volpe Annalisa, Ancona Antonio
CNR-IFN UOS BARI, Via Amendola 173, 70126 Bari, Italy.
Dipartimento Interateneo di Fisica, Università degli Studi di Bari, 70125 Bari, Italy.
Micromachines (Basel). 2020 Mar 22;11(3):327. doi: 10.3390/mi11030327.
We report on a one-step method for cutting 250-µm-thick quartz plates using highly focused ultrashort laser pulses with a duration of 200 fs and a wavelength of 1030 nm. We show that the repetition rate, the scan speed, the pulse overlap and the pulse energy directly influence the cutting process and quality. Therefore, a suitable choice of these parameters was necessary to get single-pass stealth dicing with neat and flat cut edges. The mechanism behind the stealth dicing process was ascribed to tensile stresses generated by the relaxation of the compressive stresses originated in the laser beam focal volume during irradiation in the bulk material. Such stresses produced micro-fractures whose controlled propagation along the laser beam path led to cutting of the samples.
我们报道了一种使用持续时间为200飞秒、波长为1030纳米的高聚焦超短激光脉冲切割250微米厚石英板的一步法。我们表明，重复频率、扫描速度、脉冲重叠率和脉冲能量直接影响切割过程和质量。因此，为了实现具有整齐和平整切割边缘的单通道隐形切割，必须适当选择这些参数。隐形切割过程背后的机制归因于在块状材料中辐照期间，激光束焦体积内产生的压缩应力松弛所产生的拉伸应力。这种应力产生了微裂纹，微裂纹沿激光束路径的受控扩展导致了样品的切割。
