Li Yuhang, Chen Jiayun, Zhao Shuang, Song Jizhou
Institute of Solid Mechanics, Beihang University (BUAA), Beijing 100191, China.
State Key Laboratory of Structural Analysis for Industrial Equipment, Dalian University of Technology, Dalian 116024, China.
Micromachines (Basel). 2020 Apr 9;11(4):390. doi: 10.3390/mi11040390.
Flexible inorganic electronic devices (FIEDs) consisting of functional inorganic components on a soft polymer substrate have enabled many novel applications such as epidermal electronics and wearable electronics, which cannot be realized through conventional rigid electronics. The low thermal dissipation capacity of the soft polymer substrate of FIEDs demands proper thermal management to reduce the undesired thermal influences. The biointegrated applications of FIEDs pose even more stringent requirements on thermal management due to the sensitive nature of biological tissues to temperature. In this review, we take microscale inorganic light-emitting diodes (μ-ILEDs) as an example of functional components to summarize the recent advances on thermal management of FIEDs including thermal analysis, thermo-mechanical analysis and thermal designs of FIEDs with and without biological tissues. These results are very helpful to understand the underlying heat transfer mechanism and provide design guidelines to optimize FIEDs in practical applications.
由软聚合物基板上的功能性无机组件组成的柔性无机电子器件（FIED）实现了许多新颖的应用，如表皮电子器件和可穿戴电子器件，而这些应用是传统刚性电子器件无法实现的。FIED的软聚合物基板的低热耗散能力要求进行适当的热管理，以减少不良的热影响。由于生物组织对温度敏感，FIED的生物集成应用对热管理提出了更严格的要求。在本综述中，我们以微尺度无机发光二极管（μ-ILED）作为功能组件的示例，总结了FIED热管理的最新进展，包括有和没有生物组织的FIED的热分析、热机械分析和热设计。这些结果对于理解潜在的热传递机制非常有帮助，并为在实际应用中优化FIED提供设计指导。
