Yin Yafei, Li Min, Yuan Wei, Chen Xiaolian, Li Yuhang
Institute of Solid Mechanics, Beihang University (BUAA), Beijing 100191, People's Republic of China.
Printable Electronics Research Centre, Suzhou Institute of Nanotech and Nano-bionics, Chinese Academy of Sciences, Suzhou 215123, People's Republic of China.
Proc Math Phys Eng Sci. 2019 Aug;475(2228):20190402. doi: 10.1098/rspa.2019.0402. Epub 2019 Aug 21.
Flexible electronics, as a relatively new category of device, exhibit prodigious potential in many applications, especially in bio-integrated fields. It is critical to understand that thermal management of certain kinds of exothermic flexible electronics is a crucial issue, whether to avoid or to take advantage of the excessive temperature. A widely adaptable analytical method, validated by finite-element analysis and experiments, is conducted to investigate the thermal properties of exothermic flexible electronics with a heat source in complex shape or complex array layout. The main theoretical strategy to obtain the thermal field is through an integral along the complex curve source region. The results predicted by the analytical model enable accurate control of temperature and heat flow in the flexible electronics, which may help in the design and fabrication of flexible electronic devices in the future.
柔性电子器件作为一类相对较新的器件，在许多应用中展现出巨大潜力，尤其是在生物集成领域。必须认识到，对于某些放热型柔性电子器件而言，热管理是一个关键问题，无论是要避免还是利用过高的温度。本文采用一种经过有限元分析和实验验证的广泛适用的分析方法，来研究具有复杂形状热源或复杂阵列布局的放热型柔性电子器件的热特性。获取热场的主要理论策略是通过沿复杂曲线源区域进行积分。该分析模型预测的结果能够实现对柔性电子器件中温度和热流的精确控制，这可能有助于未来柔性电子器件的设计与制造。
