Tengsuthiwat Jiratti, Sanjay Mavinkere Rangappa, Siengchin Suchart, Pruncu Catalin I
Department of Mechanical Engineering Technology, College of Industrial Technology, King Mongkut's of University Technology North Bangkok, Bangsue, Bangkok 10800, Thailand.
Natural Composites Research Group Lab, King Mongkut's of University Technology North Bangkok, Bangsue, Bangkok 10800, Thailand.
Polymers (Basel). 2020 Jun 23;12(6):1408. doi: 10.3390/polym12061408.
The three-dimensional molded interconnected device (3D-MID) has received considerable attention because of the growing demand for greater functionality and miniaturization of electronic parts. Polymer based composite are the primary choice to be used as substrate. These materials enable flexibility in production from macro to micro-MID products, high fracture toughness when subjected to mechanical loading, and they are lightweight. This survey proposes a detailed review of different types of 3D-MID modules, also presents the requirement criteria for manufacture a polymer substrate and the main surface modification techniques used to enhance the polymer substrate. The findings presented here allow to fundamentally understand the concept of 3D-MID, which can be used to manufacture a novel polymer composite substrate.
由于对电子部件功能增强和小型化的需求不断增长，三维模塑互连器件（3D-MID）受到了广泛关注。聚合物基复合材料是用作基板的主要选择。这些材料在从宏观到微观MID产品的生产中具有灵活性，在承受机械载荷时具有高断裂韧性，并且重量轻。本综述对不同类型的3D-MID模块进行了详细回顾，还提出了制造聚合物基板的要求标准以及用于增强聚合物基板的主要表面改性技术。这里呈现的研究结果有助于从根本上理解3D-MID的概念，可用于制造新型聚合物复合基板。
