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氢氟酸烧伤

Hydrofluoric acid burns.

作者信息

Edelman P

出版信息

Occup Med. 1986 Jan-Mar;1(1):89-103.

PMID:3299779
Abstract

Chemical burns sustained in the microelectronics industry consist mostly of injuries to the skin of the hand and face. The injuries are caused by splashes, holes in gloves, or accidental use of a chemical improperly. The chemical burns of the face primarily involve splashes. Employee education and the ability to intervene swiftly are the foundations of prevention of serious injury. Every facility using hydrogen fluoride should be certain that they have current treatment protocols reviewed by someone with expertise in this area. Furthermore, companies should not assume that all local physicians are knowledgeable about hydrogen fluoride and should educate them as well.

摘要

微电子行业遭受的化学灼伤大多是手部和面部皮肤受伤。这些损伤是由飞溅、手套破损或化学品使用不当造成的。面部化学灼伤主要是由飞溅引起的。员工教育和迅速干预的能力是预防严重伤害的基础。每个使用氟化氢的设施都应确保有由该领域专家审核的现行治疗方案。此外,公司不应假定所有当地医生都了解氟化氢,也应对他们进行培训。

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