School of Mechanical and Aerospace Engineering, Jilin University, Changchun 130012, China.
Key Laboratory for Micro/Nano Technology and Systems of Liaoning Province, Dalian University of Technology, Dalian, 116024, China.
J Nanosci Nanotechnol. 2021 Mar 1;21(3):1672-1677. doi: 10.1166/jnn.2021.19023.
Microfluidic chips made by traditional materials (glass and silicon) are still important for fluorescence tests, biocompatible experiments, and high temperature applications. However, the majority of the present bonding methods suffer from ultra-clean requirement, complicated fabrication process, and low production efficiency. In the present work, an Electrohydrodynamic printing assist bonding method was proposed. By this method, the ultraviolet-cured-glue dots were printed onto the silicon substrate, and then the patterned glass and silicon substrate can be bonded together at room temperature. The influence of printing condition (nozzle inner-diameter, applied voltage, printing height, and flow rate) on the diameter of printed dot was analyzed by experiments. By the optimized printing condition, the glass-silicon microfluidic chip can be well bonded. The bonding strength and leakage test demonstrated the high bonding quality of the microfluidic chip (bonding strength of 28 MPa and leakage pressure of 3.5 MPa).
由传统材料（玻璃和硅）制成的微流控芯片仍然在荧光测试、生物相容性实验和高温应用中非常重要。然而，目前大多数的键合方法都存在超洁净要求、复杂的制造工艺和低生产效率的问题。在本工作中，提出了一种电动力学打印辅助键合方法。通过该方法，将紫外光固化胶点打印到硅基底上，然后可以在室温下将图案化的玻璃和硅基底键合在一起。通过实验分析了打印条件（喷嘴内径、施加电压、打印高度和流速）对打印点直径的影响。通过优化的打印条件，可以很好地实现玻璃-硅微流控芯片的键合。键合强度和泄漏测试证明了微流控芯片的高键合质量（键合强度为 28 MPa，泄漏压力为 3.5 MPa）。
