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氧空位缺陷 SnO₂的电子电导率、结构和电子性质的第一性原理研究。

First-Principles Study of Electronic Conductivity, Structural and Electronic Properties of Oxygen-Vacancy-Defected SnO₂.

机构信息

Department of Physics and Earth Sciences, University of Ferrara, Via G. Saragat 1/C, 44122, Ferrara, Italy.

Micro Nano Facility (MNF), Bruno Kessler Foundation (FBK), Via Sommarive 18, 38123 Trento, Italy.

出版信息

J Nanosci Nanotechnol. 2021 Apr 1;21(4):2633-2640. doi: 10.1166/jnn.2021.19116.

Abstract

The use of computer simulations has become almost essential for prediction and interpretation of device's performance. In gas sensing field, the simulation of specific conditions, which determine the physical-chemical properties of widely used metal oxide semiconductors, can be used to investigate the performance of gas sensors based on these kinds of materials. The aim of this work was to evaluate the physical-chemical properties of tin dioxide employed for environmental and health gas sensing application and to investigate the influence of oxygen vacancies on its properties by means of density functional theory. Two samples, having different concentration of oxygen vacancies, were deeply studied in terms of their structural, electronic and electrical properties. It was proved the influence of oxygen vacancies on lattice parameter. By increasing oxygen vacancies concentration, the increased number of impurity states took these closer to the conduction band minimum, which can lead to an easier adsorption process of oxygen species and their availability to be exchanges with the molecules of the target gases. In this way a reduction of the operating temperature can be observed, thus reducing the power consumption of devices, while keeping the catalytic performance of the material.

摘要

计算机模拟的使用对于预测和解释器件性能几乎是必不可少的。在气体传感领域,模拟决定广泛使用的金属氧化物半导体物理化学性质的特定条件,可以用于研究基于这些材料的气体传感器的性能。本工作的目的是评估用于环境和健康气体传感应用的二氧化锡的物理化学性质,并通过密度泛函理论研究氧空位对其性质的影响。对具有不同氧空位浓度的两种样品进行了深入研究,以研究其结构、电子和电气性质。证明了氧空位对晶格参数的影响。随着氧空位浓度的增加,杂质态的数量增加,这些杂质态更接近导带最小值,这可能导致氧物种更容易吸附,并且它们可以与目标气体的分子进行交换。这样可以观察到操作温度的降低,从而降低器件的功耗,同时保持材料的催化性能。

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