Fonseca Luis, Donmez-Noyan Inci, Dolcet Marc, Estrada-Wiese Denise, Santander Joaquin, Salleras Marc, Gadea Gerard, Pacios Mercè, Sojo Jose-Manuel, Morata Alex, Tarancon Albert
Instituto de Microelectrónica de Barcelona, IMB-CNM (CSIC), C/Til·lers s/n-Campus UAB, Bellaterra, 08193 Barcelona, Spain.
Department of Advanced Materials for Energy Applications, Catalonia Institute for Energy Research (IREC), C/Jardí de les Dones de Negre 1, Planta 2, 08930 Barcelona, Spain.
Nanomaterials (Basel). 2021 Feb 18;11(2):517. doi: 10.3390/nano11020517.
The thermoelectric performance of nanostructured low dimensional silicon and silicon-germanium has been functionally compared device-wise. The arrays of nanowires of both materials, grown by a VLS-CVD (Vapor-Liquid-Solid Chemical Vapor Deposition) method, have been monolithically integrated in a silicon micromachined structure in order to exploit the improved thermoelectric properties of nanostructured silicon-based materials. The device architecture helps to translate a vertically occurring temperature gradient into a lateral temperature difference across the nanowires. Such thermocouple is completed with a thin film metal leg in a unileg configuration. The device is operative on its own and can be largely replicated (and interconnected) using standard IC (Integrated Circuits) and MEMS (Micro-ElectroMechanical Systems) technologies. Despite SiGe nanowires devices show a lower Seebeck coefficient and a higher electrical resistance, they exhibit a much better performance leading to larger open circuit voltages and a larger overall power supply. This is possible due to the lower thermal conductance of the nanostructured SiGe ensemble that enables a much larger internal temperature difference for the same external thermal gradient. Indeed, power densities in the μW/cm could be obtained for such devices when resting on hot surfaces in the 50-200 °C range under natural convection even without the presence of a heat exchanger.
已在器件层面上对纳米结构的低维硅和硅锗的热电性能进行了功能比较。通过VLS-CVD(汽-液-固化学气相沉积)方法生长的这两种材料的纳米线阵列,已被单片集成到硅微机械结构中,以便利用纳米结构硅基材料改善的热电性能。该器件架构有助于将垂直出现的温度梯度转化为纳米线两端的横向温差。这种热电偶由单腿配置的薄膜金属腿构成。该器件可独立运行,并且可以使用标准集成电路(IC)和微机电系统(MEMS)技术大量复制(并相互连接)。尽管硅锗纳米线器件的塞贝克系数较低且电阻较高,但它们表现出更好的性能,从而产生更大的开路电压和更大的总电源。这是因为纳米结构硅锗整体的热导率较低,对于相同的外部热梯度能够产生大得多的内部温差。实际上,即使没有热交换器,在自然对流条件下,当这些器件放置在50-200°C范围内的热表面上时,也能够获得μW/cm级的功率密度。