Thurston John H, Clifford Andrew J, Henderson Bradley S, Smith Tyler R, Quintana Dylan, Cudworth Katelyn F, Lujan Trevor J, Cornell Kenneth A
Department of Chemistry, The College of Idaho, Caldwell, Idaho 83605, United States.
Department of Mechanical and Biomedical Engineering, Boise State University, Boise, Idaho 83725, United States.
ACS Appl Bio Mater. 2020 Mar 16;3(3):1681-1689. Epub 2020 Feb 18.
Free-standing, composite hydrogels containing the visible-light responsive metal-free semiconductor graphitic carbon nitride (-CN) as an integral component have been fabricated by direct casting techniques. At 0.67% -CN loading, intermolecular interactions between the semiconductor particles and the PVA polymer chains enhance both the mechanical and photophysical properties of the resulting hydrogels. In contrast, much higher -CN loadings of 3.3 or 6.7% -CN resulted in growth of the average semiconductor particle size and reduction in interactions between the incorporated photocatalyst and the PVA chains. The increased dimensions of the -CN semiconductor particles had the effect of compromising the mechanical properties of the composite system and reducing the lifetime of photogenerated charge carriers. However, the close proximity of -CN particles that is realized at increased semiconductor loading densities improves the absorption cross section of the material, resulting in an overall improvement in the photocatalytic activity of the material. Application of visible radiation caused all of the composite hydrogels to generate hydrogen peroxide (HO) at catalytic rates of 0.9-2.5 M/min, while HO decomposition rates remained similar across the different preparations. In studies to examine antimicrobial performance, irradiation of 6.7% -CN/PVA hydrogel samples with visible radiation (400 ≤ λ ≤ 800 nm) generated sufficient HO to significantly reduce both the viable planktonic cell population and biofilm formation in cultures of .
通过直接浇铸技术制备了包含可见光响应性无金属半导体石墨相氮化碳(-CN)作为整体成分的独立复合水凝胶。在-CN负载量为0.67%时,半导体颗粒与聚乙烯醇(PVA)聚合物链之间的分子间相互作用增强了所得水凝胶的机械性能和光物理性能。相比之下,-CN负载量高得多的3.3%或6.7%-CN会导致平均半导体颗粒尺寸增大,且掺入的光催化剂与PVA链之间的相互作用减少。-CN半导体颗粒尺寸的增加会损害复合体系的机械性能,并缩短光生载流子的寿命。然而,在提高半导体负载密度时实现的-CN颗粒紧密接近会改善材料的吸收截面,从而使材料的光催化活性总体提高。施加可见光会使所有复合水凝胶以0.9 - 2.5 M/分钟的催化速率产生过氧化氢(HO),而不同制剂的HO分解速率保持相似。在研究抗菌性能时,用可见光(400≤λ≤800 nm)照射6.7%-CN/PVA水凝胶样品会产生足够的HO,从而显著减少培养物中活的浮游细胞数量和生物膜形成。